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SN65LVDS386DGGR - Texas Instruments

Description: 16-Channel LVDS Receiver

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SN65LVDS386DGGR - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - DGG(R-PDSO-G)
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SN65LVDS386DGGR - Texas Instruments  - 3D model - Small Outline Packages - DGG(R-PDSO-G)
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SN65LVDS386DGGR Details

  • Manufacturer Part Number:

    SN65LVDS386DGGR

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    TSSOP

  • Package Description:

    TSSOP-64

  • Pin Count:

    64

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • High Level Input Current-Max:

    0.00001 A

  • Input Characteristics:

    DIFFERENTIAL

  • Interface IC Type:

    LINE RECEIVER

  • Interface Standard:

    EIA-644; TIA-644

  • JESD-30 Code:

    R-PDSO-G64

  • JESD-609 Code:

    e4

  • Length:

    17 mm

  • Moisture Sensitivity Level:

    2

  • Number of Functions:

    16

  • Number of Terminals:

    64

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Out Swing-Min:

    2 V

  • Output Characteristics:

    TOTEM-POLE

  • Output Low Current-Max:

    0.008 A

  • Output Polarity:

    TRUE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP64,.32,20

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Receive Delay-Max:

    4 ns

  • Receiver Number of Bits:

    16

  • Seated Height-Max:

    1.2 mm

  • Supply Current-Max:

    70 mA

  • Supply Voltage-Max:

    3.6 V

  • Supply Voltage-Min:

    3 V

  • Supply Voltage-Nom:

    3.3 V

  • Supply Voltage1-Max:

    3.6 V

  • Supply Voltage1-Min:

    3 V

  • Supply Voltage1-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    6.1 mm

SN65LVDS386DGGR Frequently Asked Questions (FAQs)

  • The maximum cable length supported by the SN65LVDS386DGGR is approximately 10 meters (33 feet) at a data rate of 1.485 Gbps. However, this length can vary depending on the specific application, cable quality, and environmental conditions.
  • To ensure signal integrity with the SN65LVDS386DGGR, it is recommended to use a differential pair for the LVDS signals, keep the traces as short as possible, and use a common mode choke or ferrite bead to filter out electromagnetic interference (EMI). Additionally, use a signal integrity analysis tool to simulate and optimize the signal transmission.
  • The power consumption of the SN65LVDS386DGGR depends on the operating frequency and the output load. According to the datasheet, the typical power consumption is around 150 mW at 1.485 Gbps with a 100-ohm load. However, this value can vary depending on the specific application and operating conditions.
  • Yes, the SN65LVDS386DGGR is designed for high-speed data transmission over long distances. It supports data rates up to 1.485 Gbps and is suitable for applications such as video transmission, high-speed data acquisition, and industrial control systems.
  • To troubleshoot issues with the SN65LVDS386DGGR, start by checking the power supply voltage, clock frequency, and signal integrity. Use an oscilloscope to verify the signal quality and check for any signs of signal degradation or distortion. Also, ensure that the device is properly terminated and that the output load is within the recommended range.

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SN65LVDS386DGGR Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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