SN74V273-7GGM - Texas Instruments

SN74V273-7GGM Details

• Manufacturer Part Number:

  SN74V273-7GGM

• Part Life Cycle Code:

  Obsolete

• Part Package Code:

  BGA

• Package Description:

  PLASTIC, BGA-100

• Pin Count:

  100

• ECCN Code:

  EAR99

• HTS Code:

  8542.32.00.71

• Manufacturer:

  Texas Instruments

• YTEOL:

  0

• Access Time-Max:

  5 ns

• Additional Feature:

  CAN ALSO BE CONFIGURED AS 32768 X 9

• Alternate Memory Width:

  9

• Clock Frequency-Max (fCLK):

  133 MHz

• Cycle Time:

  7.5 ns

• JESD-30 Code:

  S-PBGA-B100

• Length:

  10 mm

• Memory Density:

  294912 bit

• Memory IC Type:

  OTHER FIFO

• Memory Width:

  18

• Number of Functions:

  1

• Number of Terminals:

  100

• Number of Words:

  16384 words

• Number of Words Code:

  16000

• Operating Mode:

  SYNCHRONOUS

• Operating Temperature-Max:

  70 °C

• Organization:

  16KX18

• Output Enable:

  YES

• Package Body Material:

  PLASTIC/EPOXY

• Package Code:

  LFBGA

• Package Equivalence Code:

  BGA100,10X10,32

• Package Shape:

  SQUARE

• Package Style:

  GRID ARRAY, LOW PROFILE, FINE PITCH

• Parallel/Serial:

  PARALLEL

• Peak Reflow Temperature (Cel):

  NOT SPECIFIED

• Qualification Status:

  Not Qualified

• Seated Height-Max:

  1.4 mm

• Standby Current-Max:

  0.015 A

• Supply Current-Max:

  0.035 mA

• Supply Voltage-Max (Vsup):

  3.45 V

• Supply Voltage-Min (Vsup):

  3.15 V

• Supply Voltage-Nom (Vsup):

  3.3 V

• Surface Mount:

  YES

• Technology:

  CMOS

• Temperature Grade:

  COMMERCIAL

• Terminal Form:

  BALL

• Terminal Pitch:

  0.8 mm

• Terminal Position:

  BOTTOM

• Time@Peak Reflow Temperature-Max (s):

  NOT SPECIFIED

• Width:

  10 mm