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SN75C3221EPW - Texas Instruments

Description: RS-232 Interface IC RS-232 1 Mbit/s Line Driver/Receiver

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SN75C3221EPW - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - PW
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SN75C3221EPW - Texas Instruments  - 3D model - Small Outline Packages - PW
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SN75C3221EPW Details

  • Manufacturer Part Number:

    SN75C3221EPW

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    TSSOP

  • Package Description:

    TSSOP-16

  • Pin Count:

    16

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    0

  • Additional Feature:

    ALSO OPERATES AT 5V SUPPLY

  • Differential Output:

    NO

  • Driver Number of Bits:

    1

  • High Level Input Current-Max:

    0.000001 A

  • Input Characteristics:

    SCHMITT TRIGGER

  • Interface IC Type:

    LINE TRANSCEIVER

  • Interface Standard:

    EIA-232

  • JESD-30 Code:

    R-PDSO-G16

  • JESD-609 Code:

    e4

  • Length:

    5 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    16

  • Operating Temperature-Max:

    70 °C

  • Out Swing-Min:

    10 V

  • Output Characteristics:

    3-STATE

  • Output Low Current-Max:

    0.0016 A

  • Output Polarity:

    INVERTED

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP16,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Receiver Number of Bits:

    1

  • Seated Height-Max:

    1.2 mm

  • Supply Current-Max:

    1 mA

  • Supply Voltage-Max:

    3.6 V

  • Supply Voltage-Min:

    3 V

  • Supply Voltage-Nom:

    3.3 V

  • Supply Voltage1-Max:

    3.6 V

  • Supply Voltage1-Min:

    3 V

  • Supply Voltage1-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    BICMOS

  • Temperature Grade:

    COMMERCIAL

  • Terminal Finish:

    NICKEL PALLADIUM GOLD

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    4.4 mm

SN75C3221EPW Frequently Asked Questions (FAQs)

  • The maximum cable length supported by the SN75C3221EPW depends on the specific application and the type of cable used. However, as a general guideline, the device can support cable lengths up to 100 meters at a data rate of 100 Mbps.
  • The SN75C3221EPW can be configured for half-duplex or full-duplex operation by setting the appropriate pins on the device. For half-duplex operation, the TXEN pin should be tied to the RXEN pin, while for full-duplex operation, the TXEN pin should be tied to VCC and the RXEN pin should be tied to GND.
  • The power consumption of the SN75C3221EPW depends on the operating mode and the data rate. In typical operating conditions, the device consumes around 150 mA at 100 Mbps and 50 mA at 10 Mbps.
  • Yes, the SN75C3221EPW is rated for operation in the industrial temperature range of -40°C to 85°C, making it suitable for use in industrial applications.
  • To ensure EMC with the SN75C3221EPW, it is recommended to follow proper PCB design and layout guidelines, use shielding and grounding techniques, and implement EMI filtering and shielding on the device's inputs and outputs.

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SN75C3221EPW Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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