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SN75DP119RHHR - Texas Instruments

Description: Signal Repeater and Signal Conditioner

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PCB Footprints
SN75DP119RHHR - Texas Instruments PCB footprint - Other - Other - QFN50P600X600X100-37N
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3D Models
SN75DP119RHHR - Texas Instruments  - 3D model - Other - QFN50P600X600X100-37N
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SN75DP119RHHR Details

  • Manufacturer Part Number:

    SN75DP119RHHR

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    QFN

  • Pin Count:

    36

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Consumer IC Type:

    CONSUMER CIRCUIT

  • JESD-30 Code:

    S-PQCC-N36

  • JESD-609 Code:

    e4

  • Length:

    6 mm

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    36

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVQCCN

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1 mm

  • Supply Voltage-Max (Vsup):

    3.6 V

  • Supply Voltage-Min (Vsup):

    3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    6 mm

SN75DP119RHHR Frequently Asked Questions (FAQs)

  • Texas Instruments provides a recommended PCB layout in the application note SLVAE04, which includes guidelines for component placement, routing, and thermal management to ensure optimal performance and minimize electromagnetic interference (EMI).
  • The SN75DP119RHHR has a thermal pad that must be connected to a thermal plane on the PCB to dissipate heat. A thermal via or a copper pour on the PCB can be used to dissipate heat. Additionally, the device can be mounted on a heat sink or a metal core PCB to further improve thermal dissipation.
  • The maximum cable length supported by the SN75DP119RHHR depends on the specific application and the type of cable used. However, as a general guideline, the device can support cable lengths up to 100 meters at a data rate of 1 Gbps. For longer cable lengths, repeaters or active cables may be required.
  • The SN75DP119RHHR has several configuration options, such as the ability to select between different data rates, output voltage levels, and input equalization settings. These options can be configured through the device's pins or through an external microcontroller. Texas Instruments provides a configuration guide in the device's datasheet and application notes.
  • The SN75DP119RHHR is designed to meet the electromagnetic compatibility (EMC) requirements of various standards, including CISPR 25 and FCC Part 15. To minimize EMI and RFI, it is recommended to follow proper PCB layout and design guidelines, use shielding and filtering, and ensure that the device is properly grounded.

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SN75DP119RHHR Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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