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SN75LBC180ADRG4 - Texas Instruments

Description: RS-485 Interface IC Lo-Pwr Diff Ln Drvr & Receiver Pair

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SN75LBC180ADRG4 - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - D (-R-PDSO-G14)_1
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SN75LBC180ADRG4 - Texas Instruments  - 3D model - Small Outline Packages - D (-R-PDSO-G14)_1
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SN75LBC180ADRG4 Details

  • Manufacturer Part Number:

    SN75LBC180ADRG4

  • Brand Name:

    Texas Instruments

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    SOIC

  • Package Description:

    SOIC-14

  • Pin Count:

    14

  • Country Of Origin:

    Mexico

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    0

  • Differential Output:

    YES

  • Driver Number of Bits:

    1

  • High Level Input Current-Max:

    0.0001 A

  • Input Characteristics:

    DIFFERENTIAL SCHMITT TRIGGER

  • Interface IC Type:

    LINE TRANSCEIVER

  • Interface Standard:

    EIA-485-A; TIA-485-A; ISO 8482

  • JESD-30 Code:

    R-PDSO-G14

  • JESD-609 Code:

    e4

  • Length:

    8.65 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    14

  • Operating Temperature-Max:

    70 °C

  • Out Swing-Min:

    1.1 V

  • Output Characteristics:

    DIFFERENTIAL

  • Output Low Current-Max:

    0.008 A

  • Output Polarity:

    COMPLEMENTARY

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP14,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Receive Delay-Max:

    20 ns

  • Receiver Number of Bits:

    1

  • Seated Height-Max:

    1.75 mm

  • Supply Current-Max:

    15 mA

  • Supply Voltage-Max:

    5.25 V

  • Supply Voltage-Min:

    4.75 V

  • Supply Voltage-Nom:

    5 V

  • Supply Voltage1-Max:

    5.25 V

  • Supply Voltage1-Min:

    4.75 V

  • Supply Voltage1-Nom:

    5 V

  • Surface Mount:

    YES

  • Technology:

    BICMOS

  • Temperature Grade:

    COMMERCIAL

  • Terminal Finish:

    NICKEL PALLADIUM GOLD

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transmit Delay-Max:

    12 ns

  • Width:

    3.9 mm

SN75LBC180ADRG4 Frequently Asked Questions (FAQs)

  • Texas Instruments provides a recommended PCB layout in the application note SLVAE04, which includes guidelines for trace routing, component placement, and thermal management to ensure optimal performance and minimize electromagnetic interference (EMI).
  • The SN75LBC180ADRG4 has a thermal pad that must be connected to a thermal plane on the PCB to dissipate heat. A thermal via or a copper pour on the PCB can be used to connect the thermal pad to the thermal plane. Additionally, the device's thermal resistance can be reduced by using a heat sink or a thermal interface material.
  • The maximum cable length supported by the SN75LBC180ADRG4 depends on the specific application and the type of cable used. However, as a general guideline, the device can support cable lengths up to 100 meters at a data rate of 1 Gbps. For longer cable lengths, repeaters or active cables may be required.
  • The SN75LBC180ADRG4 can be configured for different data rates using the RATE_SEL pins. The device supports data rates from 10 Mbps to 1 Gbps, and the specific configuration depends on the application requirements. Refer to the datasheet and application notes for detailed information on configuring the device for a specific data rate.
  • The power consumption of the SN75LBC180ADRG4 depends on the specific application and the data rate. However, the typical power consumption is around 150 mA at 1 Gbps, and the device has a power-down mode that can reduce the power consumption to around 10 mA.

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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