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SN75LVDS86ADGG - Texas Instruments

Description: FlatLink™ Receiver 0/4 Receiver LVDS 48-TSSOP

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SN75LVDS86ADGG - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - DGG (R-PDSO-G48)
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SN75LVDS86ADGG - Texas Instruments  - 3D model - Small Outline Packages - DGG (R-PDSO-G48)
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SN75LVDS86ADGG Details

  • Manufacturer Part Number:

    SN75LVDS86ADGG

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    TSSOP

  • Package Description:

    TSSOP-48

  • Pin Count:

    48

  • Country Of Origin:

    Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • High Level Input Current-Max:

    0.00002 A

  • Input Characteristics:

    DIFFERENTIAL

  • Interface IC Type:

    LINE RECEIVER

  • Interface Standard:

    EIA-644; TIA-644

  • JESD-30 Code:

    R-PDSO-G48

  • JESD-609 Code:

    e4

  • Length:

    12.5 mm

  • Moisture Sensitivity Level:

    2

  • Number of Functions:

    1

  • Number of Terminals:

    48

  • Operating Temperature-Max:

    70 °C

  • Out Swing-Min:

    2 V

  • Output Characteristics:

    TOTEM-POLE

  • Output Low Current-Max:

    0.002 A

  • Output Polarity:

    TRUE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP48,.3,20

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Receive Delay-Max:

    7 ns

  • Receiver Number of Bits:

    3

  • Seated Height-Max:

    1.2 mm

  • Supply Current-Max:

    40 mA

  • Supply Voltage-Max:

    3.6 V

  • Supply Voltage-Min:

    3 V

  • Supply Voltage-Nom:

    3.3 V

  • Supply Voltage1-Max:

    3.6 V

  • Supply Voltage1-Min:

    3 V

  • Supply Voltage1-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    COMMERCIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    6.1 mm

SN75LVDS86ADGG Frequently Asked Questions (FAQs)

  • The maximum cable length supported by the SN75LVDS86ADGG is dependent on the specific application and the type of cable used. However, as a general guideline, Texas Instruments recommends a maximum cable length of 10 meters for a single-ended signal and 20 meters for a differential signal.
  • The LVDS outputs of the SN75LVDS86ADGG should be terminated with a 100-ohm differential load to ensure proper signal integrity and to minimize reflections. A 100-ohm resistor can be connected between the positive and negative outputs of each channel.
  • The power-up sequence for the SN75LVDS86ADGG is not explicitly stated in the datasheet, but it is recommended to power up the device in the following sequence: VCC, then VCCIO, and finally the input clock signal. This sequence helps to ensure proper device operation and minimizes the risk of latch-up or other power-up related issues.
  • Yes, the SN75LVDS86ADGG can be used with a 3.3V power supply. The device is specified to operate from a 2.5V to 3.6V power supply, making it compatible with 3.3V systems.
  • The SN75LVDS86ADGG has a thermal pad on the bottom of the package that should be connected to a thermal plane or a heat sink to ensure proper thermal dissipation. The device has a maximum junction temperature of 150°C, and it is recommended to keep the junction temperature below 125°C for reliable operation.

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SN75LVDS86ADGG Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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