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SN75LVDT386DGGR - Texas Instruments

Description: 250-Mbps 16-channel LVDS receiver with flow-through pinout

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SN75LVDT386DGGR - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - DGG (R-PDSO-G**)
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SN75LVDT386DGGR - Texas Instruments  - 3D model - Small Outline Packages - DGG (R-PDSO-G**)
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SN75LVDT386DGGR Details

  • Manufacturer Part Number:

    SN75LVDT386DGGR

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    TSSOP

  • Package Description:

    TSSOP-64

  • Pin Count:

    64

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • High Level Input Current-Max:

    0.00001 A

  • Input Characteristics:

    DIFFERENTIAL

  • Interface IC Type:

    LINE RECEIVER

  • Interface Standard:

    EIA-644; TIA-644

  • JESD-30 Code:

    R-PDSO-G64

  • JESD-609 Code:

    e4

  • Length:

    17 mm

  • Moisture Sensitivity Level:

    2

  • Number of Functions:

    16

  • Number of Terminals:

    64

  • Operating Temperature-Max:

    70 °C

  • Out Swing-Min:

    2 V

  • Output Characteristics:

    TOTEM-POLE

  • Output Low Current-Max:

    0.008 A

  • Output Polarity:

    TRUE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP64,.32,20

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Receive Delay-Max:

    4 ns

  • Receiver Number of Bits:

    16

  • Seated Height-Max:

    1.2 mm

  • Supply Current-Max:

    70 mA

  • Supply Voltage-Max:

    3.6 V

  • Supply Voltage-Min:

    3 V

  • Supply Voltage-Nom:

    3.3 V

  • Supply Voltage1-Max:

    3.6 V

  • Supply Voltage1-Min:

    3 V

  • Supply Voltage1-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    COMMERCIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    6.1 mm

SN75LVDT386DGGR Frequently Asked Questions (FAQs)

  • Texas Instruments provides a recommended PCB layout in the application note SLVAE03, which includes guidelines for component placement, routing, and thermal management to ensure optimal performance and minimize electromagnetic interference (EMI).
  • The thermal pad on the bottom of the package should be connected to a solid ground plane on the PCB to provide a thermal path for heat dissipation. A thermal via or a thermal pad on the PCB can be used to connect the thermal pad to the ground plane.
  • The SN75LVDT386DGGR is rated for operation from -40°C to 125°C, but the device can be operated up to 150°C with reduced performance and reliability. It's essential to consider the operating temperature range when designing the system to ensure reliable operation.
  • To ensure EMC, follow the guidelines in the application note SLVAE03, which includes recommendations for PCB layout, component selection, and shielding to minimize EMI and ensure compliance with regulatory requirements.
  • The recommended input voltage range for the SN75LVDT386DGGR is 1.8V to 3.6V, but the device can operate with input voltages as low as 1.7V and as high as 3.8V. However, operating outside the recommended range may affect performance and reliability.

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SN75LVDT386DGGR Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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