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SN75LVDT386DGG - Texas Instruments

Description: 250-Mbps 16-channel LVDS receiver with flow-through pinout

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SN75LVDT386DGG - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - DGG (R-PDSO-G64)
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SN75LVDT386DGG - Texas Instruments  - 3D model - Small Outline Packages - DGG (R-PDSO-G64)
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SN75LVDT386DGG Details

  • Manufacturer Part Number:

    SN75LVDT386DGG

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    TSSOP

  • Package Description:

    TSSOP-64

  • Pin Count:

    64

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • High Level Input Current-Max:

    0.00001 A

  • Input Characteristics:

    DIFFERENTIAL

  • Interface IC Type:

    LINE RECEIVER

  • Interface Standard:

    EIA-644; TIA-644

  • JESD-30 Code:

    R-PDSO-G64

  • JESD-609 Code:

    e4

  • Length:

    17 mm

  • Moisture Sensitivity Level:

    2

  • Number of Functions:

    16

  • Number of Terminals:

    64

  • Operating Temperature-Max:

    70 °C

  • Out Swing-Min:

    2 V

  • Output Characteristics:

    TOTEM-POLE

  • Output Low Current-Max:

    0.008 A

  • Output Polarity:

    TRUE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP64,.32,20

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Receive Delay-Max:

    4 ns

  • Receiver Number of Bits:

    16

  • Seated Height-Max:

    1.2 mm

  • Supply Current-Max:

    70 mA

  • Supply Voltage-Max:

    3.6 V

  • Supply Voltage-Min:

    3 V

  • Supply Voltage-Nom:

    3.3 V

  • Supply Voltage1-Max:

    3.6 V

  • Supply Voltage1-Min:

    3 V

  • Supply Voltage1-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    COMMERCIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    6.1 mm

SN75LVDT386DGG Frequently Asked Questions (FAQs)

  • A good PCB layout for the SN75LVDT386DGG involves keeping the input and output traces separate, using a solid ground plane, and minimizing the length of the input traces to reduce noise and crosstalk. TI provides a recommended PCB layout in the datasheet.
  • Proper termination for the SN75LVDT386DGG involves using a 50-ohm termination resistor at the receiver end, and ensuring that the transmission line is properly matched to the characteristic impedance of the PCB material. TI provides guidelines for termination in the datasheet.
  • The maximum cable length supported by the SN75LVDT386DGG depends on the specific application and the type of cable used. However, as a general guideline, TI recommends keeping the cable length below 10 meters to ensure reliable operation.
  • Power sequencing for the SN75LVDT386DGG involves ensuring that the power supply voltage (VCC) is applied before the input signals, and that the reset pin is properly driven to ensure a clean reset. TI provides guidelines for power sequencing in the datasheet.
  • Thermal considerations for the SN75LVDT386DGG involve ensuring that the device is operated within the recommended temperature range (-40°C to 85°C), and that the PCB is designed to dissipate heat effectively. TI provides thermal guidelines in the datasheet.

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SN75LVDT386DGG Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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