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SN65LVDT386DGGR - Texas Instruments

Description: HIGH-SPEED DIFFERENTIAL LINE RECEIVERS

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SN65LVDT386DGGR - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - DGG (R-PDSO-G64)
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SN65LVDT386DGGR - Texas Instruments  - 3D model - Small Outline Packages - DGG (R-PDSO-G64)
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SN65LVDT386DGGR Details

  • Manufacturer Part Number:

    SN65LVDT386DGGR

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    TSSOP

  • Package Description:

    TSSOP-64

  • Pin Count:

    64

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • High Level Input Current-Max:

    0.00001 A

  • Input Characteristics:

    DIFFERENTIAL

  • Interface IC Type:

    LINE RECEIVER

  • Interface Standard:

    EIA-644; TIA-644

  • JESD-30 Code:

    R-PDSO-G64

  • JESD-609 Code:

    e4

  • Length:

    17 mm

  • Moisture Sensitivity Level:

    2

  • Number of Functions:

    16

  • Number of Terminals:

    64

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Out Swing-Min:

    2 V

  • Output Characteristics:

    TOTEM-POLE

  • Output Low Current-Max:

    0.008 A

  • Output Polarity:

    TRUE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP64,.32,20

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Receive Delay-Max:

    4 ns

  • Receiver Number of Bits:

    16

  • Seated Height-Max:

    1.2 mm

  • Supply Current-Max:

    70 mA

  • Supply Voltage-Max:

    3.6 V

  • Supply Voltage-Min:

    3 V

  • Supply Voltage-Nom:

    3.3 V

  • Supply Voltage1-Max:

    3.6 V

  • Supply Voltage1-Min:

    3 V

  • Supply Voltage1-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    6.1 mm

SN65LVDT386DGGR Frequently Asked Questions (FAQs)

  • A good PCB layout for the SN65LVDT386DGGR involves keeping the differential pairs as close together as possible, using a solid ground plane, and minimizing the length of the traces. It's also recommended to use a 4-layer PCB with a dedicated power plane and a dedicated ground plane.
  • To ensure signal integrity with the SN65LVDT386DGGR, it's essential to maintain a controlled impedance environment, use differential signaling, and minimize electromagnetic interference (EMI) and radio-frequency interference (RFI). Additionally, use a common-mode choke or a ferrite bead to filter out high-frequency noise.
  • The maximum cable length supported by the SN65LVDT386DGGR depends on the specific application and the type of cable used. However, as a general guideline, the device can support cable lengths of up to 100 meters at data rates of up to 1 Gbps.
  • To troubleshoot issues with the SN65LVDT386DGGR, start by checking the power supply voltage, ensuring that it's within the recommended range. Then, verify that the device is properly configured and that the input signals are within the specified range. Use an oscilloscope to check the signal integrity and look for any signs of noise or distortion.
  • While the SN65LVDT386DGGR is designed for differential signaling, it can be used in non-differential signaling applications with some limitations. However, this may compromise the device's performance and noise immunity. It's recommended to use the device in its intended differential mode for optimal performance.

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SN65LVDT386DGGR Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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