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SN75LVDT390PW - Texas Instruments

Description: 250-Mbps quad LVDS receiver with flow-through pinout

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SN75LVDT390PW - Texas Instruments - PCB symbol
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PCB Footprints
SN75LVDT390PW - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - PW0016A
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3D Models
SN75LVDT390PW - Texas Instruments - 3D model - Small Outline Packages - PW0016A
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SN75LVDT390PW Details

  • Manufacturer Part Number:

    SN75LVDT390PW

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    TSSOP

  • Package Description:

    TSSOP-16

  • Pin Count:

    16

  • Country Of Origin:

    Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • High Level Input Current-Max:

    0.00001 A

  • Input Characteristics:

    DIFFERENTIAL

  • Interface IC Type:

    LINE RECEIVER

  • Interface Standard:

    EIA-644; TIA-644

  • JESD-30 Code:

    R-PDSO-G16

  • JESD-609 Code:

    e4

  • Length:

    5 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    4

  • Number of Terminals:

    16

  • Operating Temperature-Max:

    70 °C

  • Out Swing-Min:

    2 V

  • Output Characteristics:

    TOTEM-POLE

  • Output Low Current-Max:

    0.008 A

  • Output Polarity:

    TRUE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP16,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Receive Delay-Max:

    4 ns

  • Receiver Number of Bits:

    4

  • Seated Height-Max:

    1.2 mm

  • Supply Current-Max:

    18 mA

  • Supply Voltage-Max:

    3.6 V

  • Supply Voltage-Min:

    3 V

  • Supply Voltage-Nom:

    3.3 V

  • Supply Voltage1-Max:

    3.6 V

  • Supply Voltage1-Min:

    3 V

  • Supply Voltage1-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    COMMERCIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    4.4 mm

SN75LVDT390PW Frequently Asked Questions (FAQs)

  • Texas Instruments provides a recommended PCB layout in the application note SLVAE03, which includes guidelines for component placement, routing, and thermal management to ensure optimal performance and minimize electromagnetic interference (EMI).
  • The thermal pad on the bottom of the package should be connected to a thermal ground plane on the PCB to dissipate heat efficiently. A thermal via or a copper pour can be used to connect the thermal pad to the ground plane. Ensure that the thermal pad is not connected to any signal or power traces to avoid electrical noise and thermal issues.
  • The SN75LVDT390PW is rated for operation from -40°C to 125°C, but the maximum junction temperature (TJ) should not exceed 150°C. Ensure that the device is operated within the recommended temperature range to prevent thermal damage and ensure reliable operation.
  • To ensure EMC, follow proper PCB layout and design guidelines, such as keeping signal traces short and away from noise sources, using shielding and grounding, and implementing EMI filters or chokes as needed. Additionally, ensure that the device is operated within its recommended specifications and that the system is designed to meet relevant EMC standards.
  • The recommended power-up sequence for the SN75LVDT390PW is to apply the power supply voltage (VCC) before the input signals. This ensures that the device is properly initialized and configured before the input signals are applied. A power-up sequence diagram is provided in the datasheet.

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SN75LVDT390PW Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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