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SN75LVDT390PWR - Texas Instruments

Description: LVDS Receiver 250Mbps 16-Pin TSSOP T/R

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SN75LVDT390PWR - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - PW0016A
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SN75LVDT390PWR - Texas Instruments  - 3D model - Small Outline Packages - PW0016A
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SN75LVDT390PWR Details

  • Manufacturer Part Number:

    SN75LVDT390PWR

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    TSSOP

  • Package Description:

    TSSOP-16

  • Pin Count:

    16

  • Country Of Origin:

    Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • High Level Input Current-Max:

    0.00001 A

  • Input Characteristics:

    DIFFERENTIAL

  • Interface IC Type:

    LINE RECEIVER

  • Interface Standard:

    EIA-644; TIA-644

  • JESD-30 Code:

    R-PDSO-G16

  • JESD-609 Code:

    e4

  • Length:

    5 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    4

  • Number of Terminals:

    16

  • Operating Temperature-Max:

    70 °C

  • Out Swing-Min:

    2 V

  • Output Characteristics:

    TOTEM-POLE

  • Output Low Current-Max:

    0.008 A

  • Output Polarity:

    TRUE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP16,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Receive Delay-Max:

    4 ns

  • Receiver Number of Bits:

    4

  • Seated Height-Max:

    1.2 mm

  • Supply Current-Max:

    18 mA

  • Supply Voltage-Max:

    3.6 V

  • Supply Voltage-Min:

    3 V

  • Supply Voltage-Nom:

    3.3 V

  • Supply Voltage1-Max:

    3.6 V

  • Supply Voltage1-Min:

    3 V

  • Supply Voltage1-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    COMMERCIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    4.4 mm

SN75LVDT390PWR Frequently Asked Questions (FAQs)

  • Texas Instruments provides a recommended PCB layout in the application note SLVAE03, which includes guidelines for component placement, routing, and thermal management to ensure optimal performance and minimize electromagnetic interference (EMI).
  • To ensure reliable operation in high-temperature environments, it is essential to follow the recommended thermal management guidelines, including providing adequate heat sinking, using thermal interface materials, and keeping the device within its specified operating temperature range.
  • When using the SN75LVDT390PWR in a system with multiple voltage domains, it is crucial to ensure that the device is powered from a stable, low-noise voltage source, and that the voltage domains are properly isolated to prevent noise coupling and ensure reliable operation.
  • To troubleshoot issues with the SN75LVDT390PWR, start by verifying the power supply voltage, checking for proper termination and loading, and ensuring that the device is operated within its specified parameters. Use oscilloscopes and logic analyzers to debug the signal integrity and timing. Consult the datasheet and application notes for guidance on troubleshooting specific issues.
  • The SN75LVDT390PWR has built-in ESD protection and latch-up prevention measures, including diodes and resistors to protect against electrostatic discharge and latch-up. However, it is still essential to follow proper handling and assembly procedures to prevent damage during manufacturing and operation.

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SN75LVDT390PWR Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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