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SNJ55LBC173J - Texas Instruments

Description: ption The SN55LBC173 is a monolithic quadruple differential line receiver with 3-state outputs designed to meet the requirements of the EIA standards RS-422-A, RS-423-A, RS-485, and CCI

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SNJ55LBC173J - Texas Instruments PCB footprint - Ceramic Dual-In-Line Packages - Ceramic Dual-In-Line Packages - J(R-GDIP-T16)
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SNJ55LBC173J - Texas Instruments  - 3D model - Ceramic Dual-In-Line Packages - J(R-GDIP-T16)
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SNJ55LBC173J Details

  • Manufacturer Part Number:

    SNJ55LBC173J

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    DIP

  • Pin Count:

    16

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Driver Number of Bits:

    4

  • High Level Input Current-Max:

    0.00002 A

  • Input Characteristics:

    DIFFERENTIAL SCHMITT TRIGGER

  • Interface IC Type:

    LINE RECEIVER

  • Interface Standard:

    V.11; EIA-422-A; EIA-423-A; EIA-485

  • JESD-30 Code:

    R-CDIP-T16

  • JESD-609 Code:

    e0

  • Length:

    20.57 mm

  • Number of Functions:

    4

  • Number of Terminals:

    16

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Out Swing-Min:

    3 V

  • Output Characteristics:

    3-STATE

  • Output Low Current-Max:

    0.016 A

  • Output Polarity:

    TRUE

  • Package Body Material:

    CERAMIC, METAL-SEALED COFIRED

  • Package Code:

    DIP

  • Package Equivalence Code:

    DIP16,.3

  • Package Shape:

    RECTANGULAR

  • Package Style:

    IN-LINE

  • Qualification Status:

    Not Qualified

  • Receive Delay-Max:

    35 ns

  • Receiver Number of Bits:

    4

  • Screening Level:

    38535Q/M;38534H;883B

  • Seated Height-Max:

    4.005 mm

  • Supply Current-Max:

    11 mA

  • Supply Voltage-Max:

    5.25 V

  • Supply Voltage-Min:

    4.75 V

  • Supply Voltage-Nom:

    5 V

  • Supply Voltage1-Max:

    5.25 V

  • Supply Voltage1-Min:

    4.75 V

  • Supply Voltage1-Nom:

    5 V

  • Surface Mount:

    NO

  • Technology:

    BICMOS

  • Temperature Grade:

    MILITARY

  • Terminal Finish:

    Tin/Lead (Sn/Pb)

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Pitch:

    2.54 mm

  • Terminal Position:

    DUAL

  • Transmit Delay-Max:

    35 ns

  • Width:

    7.62 mm

SNJ55LBC173J Frequently Asked Questions (FAQs)

  • Texas Instruments provides a recommended PCB layout in the datasheet, but it's essential to follow good PCB design practices, such as using a solid ground plane, minimizing trace lengths, and avoiding vias under the package. Additionally, ensure that the input and output capacitors are placed close to the device.
  • The SNJ55LBC173J has a high power dissipation, so it's crucial to implement proper thermal management. Use a heat sink or thermal pad, and ensure good airflow around the device. The datasheet provides thermal resistance values to help with thermal design.
  • Choose input and output capacitors with low ESR and high ripple current ratings. The capacitors should be placed close to the device, and their values should be selected based on the specific application requirements, such as output voltage ripple and transient response.
  • To ensure stability, follow the recommended component values and PCB layout. Additionally, ensure that the output capacitor is properly sized, and the feedback network is correctly designed. If oscillations occur, check for parasitic inductance, capacitance, or resistance in the circuit.
  • To minimize EMI and noise, use a shielded enclosure, and ensure that the PCB layout is designed to reduce radiation. Use ferrite beads or common-mode chokes to filter the input and output lines. Additionally, consider using a snubber network to reduce switching noise.

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SNJ55LBC173J Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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