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STEF12PUR - STMicroelectronics

Description: Continuous current (typ): 3.6A,N-channel on-resistance (typ): 53mΩ,Output clamp voltage (typ): 15 V,DFN10 (3x3 mm).

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STEF12PUR - STMicroelectronics - PCB symbol
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PCB Footprints
STEF12PUR - STMicroelectronics PCB footprint - Other - Other - STEF12PUR
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3D Models
STEF12PUR - STMicroelectronics - 3D model - Other - STEF12PUR
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STEF12PUR Details

  • Manufacturer Part Number:

    STEF12PUR

  • Brand Name:

    STMicroelectronics

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    DFN

  • Package Description:

    DFN-10

  • Pin Count:

    10

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    20 Weeks

  • Manufacturer:

    STMicroelectronics

  • YTEOL:

    8

  • Adjustable Threshold:

    NO

  • Analog IC - Other Type:

    eFUSE

  • JESD-30 Code:

    S-PDSO-N10

  • JESD-609 Code:

    e4

  • Length:

    3 mm

  • Moisture Sensitivity Level:

    1

  • Number of Channels:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    10

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVSON

  • Package Equivalence Code:

    SOLCC10,.12,20

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    0.8 mm

  • Supply Voltage-Min (Vsup):

    7.6 V

  • Supply Voltage-Nom (Vsup):

    12 V

  • Surface Mount:

    YES

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Width:

    3 mm

STEF12PUR Frequently Asked Questions (FAQs)

  • STMicroelectronics recommends a 2-layer PCB with a solid ground plane on the bottom layer and a thermal relief pattern on the top layer to ensure optimal thermal performance.
  • To ensure reliable operation in high-temperature environments, it's essential to follow proper thermal management practices, such as providing adequate heat sinking, using thermal interface materials, and ensuring good airflow around the device.
  • STMicroelectronics recommends soldering at a temperature of 260°C (500°F) for 10-30 seconds, with a peak temperature not exceeding 280°C (536°F) to prevent damage to the device.
  • While STEF12PUR is designed for high-voltage applications, it's essential to ensure that the device is properly biased and that the voltage ratings are not exceeded to prevent damage or failure.
  • To troubleshoot issues with STEF12PUR, start by verifying the power supply voltage, checking for proper biasing, and ensuring that the device is properly soldered. If issues persist, consult the datasheet and application notes or contact STMicroelectronics support.

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STEF12PUR Overview

Use the download button to access the STEF12PUR schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like STEF1, or try a keyword search, such as Power Management Circuits

About STMicroelectronics

STMicroelectronics (ST) is a global semiconductor company that designs, manufactures, and markets a broad range of integrated circuits (ICs), discrete devices, and other electronic components. STMicroelectronics offers a diverse portfolio of semiconductor products covering a wide range of applications and industries. Their product categories include microcontrollers, analog and mixed-signal ICs, MEMS (Micro-Electro-Mechanical Systems) sensors, power management ICs, RF (Radio Frequency) transceivers, aut

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