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STGB20NB37LZT4 - STMicroelectronics

Description: Trans IGBT Chip N-CH 375V 40A 200000mW Automotive 3-Pin(2+Tab) D2PAK T/R

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STGB20NB37LZT4 - STMicroelectronics PCB footprint - Other - Other - STGB20NB37LZT4-2
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STGB20NB37LZT4 Details

  • Manufacturer Part Number:

    STGB20NB37LZT4

  • Brand Name:

    STMicroelectronics

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    D2PAK

  • Package Description:

    D2PAK-3

  • Pin Count:

    3

  • ECCN Code:

    EAR99

  • Manufacturer:

    STMicroelectronics

  • YTEOL:

    0

  • Case Connection:

    COLLECTOR

  • Collector Current-Max (IC):

    40 A

  • Collector-Emitter Voltage-Max:

    375 V

  • Configuration:

    SINGLE WITH BUILT-IN DIODE AND RESISTOR

  • Gate-Emitter Thr Voltage-Max:

    2 V

  • JESD-30 Code:

    R-PSSO-G2

  • JESD-609 Code:

    e3

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    175 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    200 W

  • Qualification Status:

    Not Qualified

  • Surface Mount:

    YES

  • Terminal Finish:

    MATTE TIN

  • Terminal Form:

    GULL WING

  • Terminal Position:

    SINGLE

  • Transistor Application:

    POWER CONTROL

  • Transistor Element Material:

    SILICON

  • Turn-off Time-Nom (toff):

    13500 ns

  • Turn-on Time-Nom (ton):

    2900 ns

STGB20NB37LZT4 Frequently Asked Questions (FAQs)

  • The maximum junction temperature (Tj) for the STGB20NB37LZT4 is 175°C, as specified in the datasheet. However, it's recommended to operate the device at a lower temperature to ensure reliability and longevity.
  • To ensure proper cooling, it's essential to provide a heat sink with a sufficient thermal interface material (TIM) and a thermal resistance (Rth) of less than 1°C/W. Additionally, ensure good airflow around the device and avoid blocking the heat sink's airflow path.
  • For optimal performance and thermal management, it's recommended to follow the PCB layout guidelines provided in the datasheet and application notes. Key considerations include: keeping the drain and source pins as close as possible, using a solid ground plane, and minimizing the length of the drain and source traces.
  • Yes, the STGB20NB37LZT4 is suitable for high-frequency switching applications up to 100 kHz. However, it's essential to consider the device's switching losses, gate drive requirements, and PCB layout to minimize electromagnetic interference (EMI) and ensure reliable operation.
  • To protect the STGB20NB37LZT4 from ESD, follow proper handling and storage procedures, such as using anti-static wrist straps, mats, and packaging materials. Additionally, ensure that the device is properly grounded during assembly and testing.

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STGB20NB37LZT4 Overview

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About STMicroelectronics

STMicroelectronics (ST) is a global semiconductor company that designs, manufactures, and markets a broad range of integrated circuits (ICs), discrete devices, and other electronic components. STMicroelectronics offers a diverse portfolio of semiconductor products covering a wide range of applications and industries. Their product categories include microcontrollers, analog and mixed-signal ICs, MEMS (Micro-Electro-Mechanical Systems) sensors, power management ICs, RF (Radio Frequency) transceivers, aut

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