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SZESD7551N2T5G - onsemi

Description: Stand−off Voltage: 3.3 V; Low Leakage: <1µA; IEC61000−4−2 Level 4 ESD Protection; SZ Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q101 Qualified and PPAP Capable; These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS Compliant; Ultra−Low Capacitance (0.35 pF Max); Low Clamping Voltage; Response Time is < 1 ns; Low Dynamic Resistance < 1 Ω; SZESD7551MXWT5G Wettable Flank Package

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PCB Footprints
SZESD7551N2T5G - onsemi PCB footprint - Other - Other - X2DFN2 1.0x0.6, 0.65P CASE-714AB ISSUE B
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SZESD7551N2T5G - onsemi  - 3D model - Other - X2DFN2 1.0x0.6, 0.65P CASE-714AB ISSUE B
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SZESD7551N2T5G Details

  • Manufacturer Part Number:

    SZESD7551N2T5G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    X2DFN-2

  • Package Description:

    X2DFN2, 2 PIN

  • Manufacturer Package Code:

    714AB

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Factory Lead Time:

    9 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    6

  • Additional Feature:

    EXCELLENT CLAMPING CAPABILITY, ULTRA LOW CAPACITANCE

  • Breakdown Voltage-Max:

    7.5 V

  • Breakdown Voltage-Min:

    5 V

  • Breakdown Voltage-Nom:

    6.25 V

  • Clamping Voltage-Max:

    13 V

  • Configuration:

    SINGLE, 1 CHANNEL

  • Diode Element Material:

    SILICON

  • Diode Type:

    TRANS VOLTAGE SUPPRESSOR DIODE

  • JESD-30 Code:

    R-PBCC-N2

  • JESD-609 Code:

    e4

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    CHIP CARRIER

  • Peak Reflow Temperature (Cel):

    260

  • Polarity:

    BIDIRECTIONAL

  • Power Dissipation-Max:

    0.25 W

  • Reference Standard:

    AEC-Q101; IEC-61000-4-2, 4-5

  • Rep Pk Reverse Voltage-Max:

    3.3 V

  • Reverse Current-Max:

    0.05 µA

  • Reverse Test Voltage:

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    AVALANCHE

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    NO LEAD

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

SZESD7551N2T5G Frequently Asked Questions (FAQs)

  • A good PCB layout for the SZESD7551N2T5G involves keeping the input and output traces short and away from each other, using a solid ground plane, and placing bypass capacitors close to the device. A 4-layer PCB with a dedicated power plane and a solid ground plane is recommended.
  • To ensure proper biasing, connect the VCC pin to a stable voltage source, and decouple it with a 10uF capacitor to ground. The EN pin should be tied to a logic high (VCC) to enable the device. The VIN pin should be connected to a stable input voltage source.
  • The SZESD7551N2T5G is rated for operation from -40°C to 125°C. However, the device's performance may degrade at extreme temperatures, and the maximum junction temperature should not exceed 150°C.
  • Yes, the SZESD7551N2T5G is qualified for automotive and high-reliability applications. It meets the AEC-Q100 standard for automotive applications and is manufactured using a process that meets the requirements of high-reliability industries.
  • To troubleshoot issues with the SZESD7551N2T5G, start by verifying the power supply voltage and input voltage levels. Check for proper PCB layout and decoupling. Use an oscilloscope to verify the output voltage and check for noise or oscillations. Consult the datasheet and application notes for more information.

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SZESD7551N2T5G Overview

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