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TAS2770YFFT - Texas Instruments

Description: 20W Digital Input Smart Amp with I/V Sense for Speaker Protection and 4.5-18V Supply Voltage Range

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PCB Footprints
TAS2770YFFT - Texas Instruments PCB footprint - BGA - BGA - YFF0030_2021
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3D Models
TAS2770YFFT - Texas Instruments  - 3D model - BGA - YFF0030_2021
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TAS2770YFFT Details

  • Manufacturer Part Number:

    TAS2770YFFT

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Philippines

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Date Of Intro:

    2017-12-24

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Bandwidth-Nom:

    20 kHz

  • Consumer IC Type:

    CLASS D AUDIO AMPLIFIER

  • JESD-30 Code:

    R-PBGA-B30

  • JESD-609 Code:

    e1

  • Length:

    2.519 mm

  • Moisture Sensitivity Level:

    1

  • Noise Figure-Nom:

    108 dB

  • Number of Channels:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    30

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Power-Nom:

    20 W

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    VFBGA

  • Package Equivalence Code:

    BGA30,5X6,16

  • Package Shape:

    RECTANGULAR

  • Package Style:

    GRID ARRAY, VERY THIN PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    0.625 mm

  • Supply Voltage-Max (Vsup):

    1.95 V

  • Supply Voltage-Min (Vsup):

    1.65 V

  • Surface Mount:

    YES

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.4 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    2.007 mm

TAS2770YFFT Frequently Asked Questions (FAQs)

  • A good PCB layout for the TAS2770YFFT involves keeping the analog and digital grounds separate, using a solid ground plane, and placing the device close to the audio codec. TI provides a recommended PCB layout in the datasheet and application notes.
  • To optimize the TAS2770YFFT for low power consumption, use the device's built-in power-saving features such as dynamic voltage scaling, clock gating, and shutdown modes. Additionally, optimize the system's clock frequency, use a low-power audio codec, and minimize the number of active circuits.
  • To filter out noise and interference in the TAS2770YFFT, use a combination of analog and digital filtering techniques. Implement a low-pass filter on the analog input, use the device's built-in digital filters, and consider adding external filters such as a ferrite bead or a common-mode choke.
  • To ensure EMC with the TAS2770YFFT, follow proper PCB design and layout guidelines, use shielding and grounding techniques, and implement electromagnetic interference (EMI) filters on the device's inputs and outputs. Additionally, consider using a metal shield or a Faraday cage to enclose the device.
  • The recommended thermal management strategy for the TAS2770YFFT involves using a heat sink or a thermal pad, ensuring good airflow around the device, and avoiding thermal hotspots on the PCB. TI provides thermal design guidelines in the datasheet and application notes.

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TAS2770YFFT Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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