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TB3R2D - Texas Instruments

Description: Texas Instruments TB3R2D, LVDS Receiver Quad PECL TTL, 3 → 3.6 V, 16-Pin, SOIC

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TB3R2D - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - D (R-PDSO-G16)
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TB3R2D - Texas Instruments  - 3D model - Small Outline Packages - D (R-PDSO-G16)
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TB3R2D Details

  • Manufacturer Part Number:

    TB3R2D

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    SOIC

  • Pin Count:

    16

  • Country Of Origin:

    Taiwan

  • ECCN Code:

    5A991.B.1

  • HTS Code:

    8542.39.00.90

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    0

  • Differential Output:

    YES

  • High Level Input Current-Max:

    0.00002 A

  • Input Characteristics:

    DIFFERENTIAL SCHMITT TRIGGER

  • Interface IC Type:

    LINE RECEIVER

  • JESD-30 Code:

    R-PDSO-G16

  • JESD-609 Code:

    e4

  • Length:

    9.9 mm

  • Moisture Sensitivity Level:

    2

  • Number of Functions:

    4

  • Number of Terminals:

    16

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Low Current-Max:

    0.008 A

  • Output Polarity:

    TRUE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP16,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Packing Method:

    TUBE

  • Peak Reflow Temperature (Cel):

    250

  • Qualification Status:

    Not Qualified

  • Receive Delay-Max:

    4 ns

  • Receiver Number of Bits:

    4

  • Seated Height-Max:

    1.75 mm

  • Supply Voltage-Max:

    3.6 V

  • Supply Voltage-Min:

    3 V

  • Supply Voltage-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3.9 mm

TB3R2D Frequently Asked Questions (FAQs)

  • Texas Instruments provides a recommended PCB layout in the TB3R2D evaluation module documentation, which includes guidelines for component placement, routing, and thermal management to ensure optimal performance and minimize signal integrity issues.
  • To ensure reliable operation in high-temperature environments, it is recommended to follow the thermal management guidelines provided in the datasheet, including using a heat sink, thermal interface material, and ensuring good airflow. Additionally, the device should be operated within the recommended junction temperature range of -40°C to 125°C.
  • The TB3R2D's BIST feature is designed to detect faults in the device's internal logic and memory, but it may not detect all possible faults or errors. Additionally, the BIST feature may not be able to detect faults that occur during device operation, and it is not a substitute for thorough testing and validation of the device in the end application.
  • Yes, the TB3R2D is designed to meet the requirements of various safety standards, including IEC 61508 and ISO 26262. However, it is the responsibility of the system designer to ensure that the device is used in a way that meets the specific requirements of the target safety standard, and to perform any necessary safety analysis and testing.
  • To troubleshoot issues with the TB3R2D's JTAG interface, it is recommended to check the JTAG signal integrity, ensure that the JTAG clock frequency is within the recommended range, and verify that the JTAG pins are properly connected and terminated. Additionally, Texas Instruments provides a JTAG debugging tool that can be used to diagnose and troubleshoot JTAG-related issues.

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TB3R2D Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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