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TB5D2HD - Texas Instruments

Description: 5V Quad PECL Driver

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TB5D2HD - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - D (R-PDSO-G16) (1)
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3D Models
TB5D2HD - Texas Instruments  - 3D model - Small Outline Packages - D (R-PDSO-G16) (1)
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TB5D2HD Details

  • Manufacturer Part Number:

    TB5D2HD

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    End Of Life

  • Part Package Code:

    SOIC

  • Pin Count:

    16

  • Country Of Origin:

    Taiwan

  • ECCN Code:

    5A991.B.1

  • HTS Code:

    8542.39.00.90

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Differential Output:

    YES

  • Driver Number of Bits:

    4

  • High Level Input Current-Max:

    20 A

  • Input Characteristics:

    STANDARD

  • Interface IC Type:

    LINE DRIVER

  • Interface Standard:

    GENERAL PURPOSE

  • JESD-30 Code:

    R-PDSO-G16

  • JESD-609 Code:

    e4

  • Length:

    9.9 mm

  • Moisture Sensitivity Level:

    2

  • Number of Functions:

    4

  • Number of Terminals:

    16

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Out Swing-Min:

    0.7 V

  • Output Characteristics:

    3-STATE

  • Output Polarity:

    TRUE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP16,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    250

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.75 mm

  • Supply Current-Max:

    40 mA

  • Supply Voltage-Max:

    5.5 V

  • Supply Voltage-Min:

    4.5 V

  • Supply Voltage-Nom:

    5 V

  • Surface Mount:

    YES

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transmit Delay-Max:

    2 ns

  • Width:

    3.9 mm

TB5D2HD Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and thermal vias is recommended. Ensure a minimum of 1 oz copper thickness and a thermal relief pattern around the device.
  • Implement a robust thermal management system, including a heat sink, thermal interface material, and a cooling fan. Monitor the device's junction temperature (TJ) and adjust the system accordingly.
  • Use a shielded enclosure, keep sensitive traces away from the device, and add EMI filters or chokes to the input and output lines. Ensure proper grounding and decoupling of the device.
  • Use a low-ESR capacitor for decoupling, minimize lead inductance, and optimize the PCB layout for minimal parasitic inductance. Ensure a stable input voltage and a low-impedance output.
  • Implement redundant systems, use error detection and correction mechanisms, and ensure proper thermal and voltage derating. Monitor the device's operating conditions and implement overcurrent and overvoltage protection.

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TB5D2HD Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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