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THS3001CDR - Texas Instruments

Description: High Speed Operational Amplifiers 420-MHz Curr Feedback Amp

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THS3001CDR - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - D
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THS3001CDR Details

  • Manufacturer Part Number:

    THS3001CDR

  • Brand Name:

    Texas Instruments

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    SOIC

  • Package Description:

    SOIC-8

  • Pin Count:

    8

  • Country Of Origin:

    Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    0

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    CURRENT-FEEDBACK

  • Average Bias Current-Max (IIB):

    15 µA

  • Bandwidth (3dB)-Nom:

    350 MHz

  • Bias Current-Max (IIB) @25C:

    10 µA

  • Common-mode Reject Ratio-Min:

    65 dB

  • Common-mode Reject Ratio-Nom:

    73 dB

  • Frequency Compensation:

    YES

  • Input Offset Voltage-Max:

    3000 µV

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e4

  • Length:

    4.9 mm

  • Low-Bias:

    NO

  • Low-Offset:

    NO

  • Micropower:

    NO

  • Moisture Sensitivity Level:

    1

  • Neg Supply Voltage Limit-Max:

    -16.5 V

  • Neg Supply Voltage-Nom (Vsup):

    -5 V

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    70 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.75 mm

  • Slew Rate-Nom:

    6500 V/us

  • Supply Current-Max:

    9 mA

  • Supply Voltage Limit-Max:

    16.5 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Technology:

    BIPOLAR

  • Temperature Grade:

    COMMERCIAL

  • Terminal Finish:

    NICKEL PALLADIUM GOLD

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Unity Gain BW-Nom:

    420000

  • Wideband:

    YES

  • Width:

    3.9 mm

THS3001CDR Frequently Asked Questions (FAQs)

  • A good PCB layout for the THS3001CDR involves keeping the input and output traces as short as possible, using a solid ground plane, and placing the device close to the signal source. Additionally, it's recommended to use a low-ESR capacitor for the power supply decoupling.
  • To ensure stability, make sure to follow the recommended compensation network values and layout guidelines. Also, ensure that the input and output impedance are matched, and the device is operated within its recommended operating conditions.
  • The maximum power dissipation of the THS3001CDR is dependent on the ambient temperature and the thermal resistance of the package. According to the datasheet, the maximum power dissipation is 1.4W at 25°C ambient temperature. However, it's recommended to derate the power dissipation based on the actual operating conditions.
  • Yes, the THS3001CDR can be used as a unity gain buffer. However, it's essential to ensure that the input and output impedance are matched, and the device is operated within its recommended operating conditions. Additionally, the gain bandwidth product of the device should be considered to ensure stability.
  • To protect the THS3001CDR from overvoltage and ESD, it's recommended to use voltage clamps, such as TVS diodes, and ESD protection devices, such as ESD diodes or resistors, in the input and output stages. Additionally, ensure that the device is operated within its recommended operating conditions and follow proper PCB layout guidelines.

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THS3001CDR Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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