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THS3120IDGN - Texas Instruments

Description: Single, Low Noise, High Output Drive, 475mA Current-Feedback Amplifier with Power-down

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PCB Footprints
THS3120IDGN - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - DGN0008D 2021
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3D Models
THS3120IDGN - Texas Instruments  - 3D model - Small Outline Packages - DGN0008D 2021
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THS3120IDGN Details

  • Manufacturer Part Number:

    THS3120IDGN

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    MSOP

  • Pin Count:

    8

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    CURRENT-FEEDBACK

  • Average Bias Current-Max (IIB):

    4 µA

  • Bandwidth (3dB)-Nom:

    66 MHz

  • Bias Current-Max (IIB) @25C:

    4 µA

  • Common-mode Reject Ratio-Min:

    63 dB

  • Common-mode Reject Ratio-Nom:

    70 dB

  • Frequency Compensation:

    YES

  • Input Offset Current-Max (IIO):

    15 µA

  • Input Offset Voltage-Max:

    10000 µV

  • JESD-30 Code:

    S-PDSO-G8

  • JESD-609 Code:

    e4

  • Length:

    3 mm

  • Low-Bias:

    NO

  • Low-Offset:

    NO

  • Micropower:

    NO

  • Moisture Sensitivity Level:

    1

  • Neg Supply Voltage Limit-Max:

    -16.5 V

  • Neg Supply Voltage-Nom (Vsup):

    -5 V

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Packing Method:

    TUBE

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.1 mm

  • Slew Rate-Nom:

    1500 V/us

  • Subcategory:

    Operational Amplifier

  • Supply Current-Max:

    4.25 mA

  • Supply Voltage Limit-Max:

    16.5 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Technology:

    BICMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Unity Gain BW-Nom:

    130000

  • Wideband:

    YES

  • Width:

    3 mm

THS3120IDGN Frequently Asked Questions (FAQs)

  • A good PCB layout for the THS3120IDGN involves keeping the input and output traces short and away from each other, using a solid ground plane, and placing decoupling capacitors close to the device. A 4-layer PCB with a dedicated power plane and a dedicated ground plane is recommended.
  • The choice of gain resistors depends on the desired gain and bandwidth of the amplifier. A higher gain resistor value will result in higher gain but may reduce the bandwidth. TI provides a gain resistor calculator tool to help with the selection.
  • The maximum power dissipation of the THS3120IDGN is 2.5W. However, the actual power dissipation will depend on the operating conditions, such as supply voltage, output current, and ambient temperature.
  • Yes, the THS3120IDGN can be used as a line driver. Its high output current and low output impedance make it suitable for driving cables and transmitting signals over long distances.
  • The THS3120IDGN has a built-in filter that can be used to filter out high-frequency noise. Additionally, external filters such as RC filters or ferrite beads can be used to further reduce noise.

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THS3120IDGN Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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