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THS3120CDGNG4 - Texas Instruments

Description: High Speed Operational Amplifiers Single Lo-Noise Hi-Output

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THS3120CDGNG4 - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - DGN0008D
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THS3120CDGNG4 Details

  • Manufacturer Part Number:

    THS3120CDGNG4

  • Brand Name:

    Texas Instruments

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    MSOP

  • Pin Count:

    8

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    0

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    CURRENT-FEEDBACK

  • Average Bias Current-Max (IIB):

    4 µA

  • Bandwidth (3dB)-Nom:

    66 MHz

  • Bias Current-Max (IIB) @25C:

    4 µA

  • Common-mode Reject Ratio-Min:

    63 dB

  • Common-mode Reject Ratio-Nom:

    70 dB

  • Frequency Compensation:

    YES

  • Input Offset Current-Max (IIO):

    15 µA

  • Input Offset Voltage-Max:

    10000 µV

  • JESD-30 Code:

    S-PDSO-G8

  • JESD-609 Code:

    e4

  • Length:

    3 mm

  • Low-Bias:

    NO

  • Low-Offset:

    NO

  • Micropower:

    NO

  • Moisture Sensitivity Level:

    1

  • Neg Supply Voltage Limit-Max:

    -16.5 V

  • Neg Supply Voltage-Nom (Vsup):

    -5 V

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Packing Method:

    TUBE

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.1 mm

  • Slew Rate-Nom:

    1500 V/us

  • Subcategory:

    Operational Amplifier

  • Supply Current-Max:

    4.25 mA

  • Supply Voltage Limit-Max:

    16.5 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Technology:

    BICMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Unity Gain BW-Nom:

    130000

  • Wideband:

    YES

  • Width:

    3 mm

THS3120CDGNG4 Frequently Asked Questions (FAQs)

  • Texas Instruments provides a recommended PCB layout in the THS3120 evaluation module documentation, which includes guidelines for component placement, routing, and grounding to minimize noise and ensure optimal performance.
  • The selection of input and output termination resistors depends on the specific application and signal requirements. TI provides guidelines for selecting termination resistors in the THS3120 datasheet and application notes, including considerations for impedance matching, signal integrity, and power consumption.
  • The THS3120 is specified to operate from -40°C to 125°C, but it's essential to consider the derating of the device's performance and power consumption at higher temperatures. Consult the datasheet and thermal design guidelines for more information.
  • To ensure EMC and EMI compliance, follow proper PCB design and layout practices, use shielding and filtering components as needed, and consider the device's radiated and conducted emissions. TI provides guidelines and resources for EMC and EMI compliance in the THS3120 datasheet and application notes.
  • TI recommends using a combination of ceramic and electrolytic capacitors for power supply decoupling, along with proper PCB layout and routing techniques to minimize noise and ensure stable operation. Consult the THS3120 datasheet and application notes for more information.

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THS3120CDGNG4 Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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