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THS4052IDGN - Texas Instruments

Description: 70-MHz Low-Cost Voltage-Feedback Amplifier, Dual

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THS4052IDGN - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - DGN0008D
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THS4052IDGN - Texas Instruments  - 3D model - Small Outline Packages - DGN0008D
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THS4052IDGN Details

  • Manufacturer Part Number:

    THS4052IDGN

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    MSOP

  • Package Description:

    HVSSOP-8

  • Pin Count:

    8

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    8 µA

  • Bandwidth (3dB)-Nom:

    70 MHz

  • Bias Current-Max (IIB) @25C:

    6 µA

  • Common-mode Reject Ratio-Min:

    70 dB

  • Common-mode Reject Ratio-Nom:

    100 dB

  • Frequency Compensation:

    YES

  • Input Offset Current-Max (IIO):

    0.25 µA

  • Input Offset Voltage-Max:

    10000 µV

  • JESD-30 Code:

    S-PDSO-G8

  • JESD-609 Code:

    e4

  • Length:

    3 mm

  • Low-Bias:

    NO

  • Low-Offset:

    NO

  • Micropower:

    NO

  • Moisture Sensitivity Level:

    1

  • Neg Supply Voltage Limit-Max:

    -16.5 V

  • Neg Supply Voltage-Nom (Vsup):

    -15 V

  • Number of Functions:

    2

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HTSSOP

  • Package Equivalence Code:

    TSSOP8,.19

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

  • Packing Method:

    TUBE

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.07 mm

  • Slew Rate-Min:

    240 V/us

  • Slew Rate-Nom:

    240 V/us

  • Subcategory:

    Operational Amplifier

  • Supply Current-Max:

    10.5 mA

  • Supply Voltage Limit-Max:

    16.5 V

  • Supply Voltage-Nom (Vsup):

    15 V

  • Surface Mount:

    YES

  • Technology:

    BIPOLAR

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Unity Gain BW-Nom:

    70000

  • Voltage Gain-Min:

    2000

  • Wideband:

    YES

  • Width:

    3 mm

THS4052IDGN Frequently Asked Questions (FAQs)

  • Texas Instruments provides a recommended PCB layout in the THS4052IDGN evaluation module documentation, which includes guidelines for component placement, routing, and grounding to minimize noise and ensure optimal performance.
  • The input termination depends on the specific application and signal source. For example, if the signal source has a high impedance, a 50Ω termination may be required to match the impedance and prevent signal reflections. TI provides guidance on input termination in the application notes and design guides.
  • The THS4052IDGN is rated for operation from -40°C to 125°C, but the maximum operating temperature range may vary depending on the specific application and environmental conditions. It's essential to consult the datasheet and application notes for specific guidance.
  • To ensure EMC, follow proper PCB layout and design guidelines, use shielding and filtering as needed, and ensure that the device is properly decoupled and bypassed. TI provides guidance on EMC considerations in the application notes and design guides.
  • TI recommends using a 10uF ceramic capacitor in parallel with a 1uF ceramic capacitor for power supply decoupling, placed as close as possible to the device. This helps to filter out noise and ensure stable operation.

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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