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THS4500MDGNEP - Texas Instruments

Description: Enhanced Product Wideband, Low-Distortion, Fully Differential Amplifier

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THS4500MDGNEP - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - DGN0008D
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THS4500MDGNEP - Texas Instruments  - 3D model - Small Outline Packages - DGN0008D
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THS4500MDGNEP Details

  • Manufacturer Part Number:

    THS4500MDGNEP

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC

  • Package Description:

    MSOP-8

  • Pin Count:

    8

  • Country Of Origin:

    Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    4.6 µA

  • Bandwidth (3dB)-Nom:

    30 MHz

  • Bias Current-Max (IIB) @25C:

    4.6 µA

  • Common-mode Reject Ratio-Min:

    74 dB

  • Common-mode Reject Ratio-Nom:

    80 dB

  • Frequency Compensation:

    YES

  • Input Offset Current-Max (IIO):

    2 µA

  • Input Offset Voltage-Max:

    7000 µV

  • JESD-30 Code:

    S-PDSO-G8

  • JESD-609 Code:

    e4

  • Length:

    3 mm

  • Low-Bias:

    NO

  • Low-Offset:

    NO

  • Micropower:

    NO

  • Moisture Sensitivity Level:

    1

  • Neg Supply Voltage Limit-Max:

    -8.25 V

  • Neg Supply Voltage-Nom (Vsup):

    -15 V

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HTSSOP

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

  • Packing Method:

    TUBE

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Seated Height-Max:

    1.1 mm

  • Slew Rate-Nom:

    2800 V/us

  • Supply Current-Max:

    28 mA

  • Supply Voltage Limit-Max:

    8.25 V

  • Supply Voltage-Nom (Vsup):

    15 V

  • Surface Mount:

    YES

  • Temperature Grade:

    MILITARY

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Unity Gain BW-Nom:

    300000

  • Voltage Gain-Min:

    282

  • Wideband:

    YES

  • Width:

    3 mm

THS4500MDGNEP Frequently Asked Questions (FAQs)

  • A good PCB layout for the THS4500MDGNEP involves keeping the input and output traces short and away from each other, using a solid ground plane, and placing decoupling capacitors close to the device. A 4-layer PCB with a dedicated power plane and a dedicated ground plane is recommended.
  • To ensure stability, make sure the device is properly decoupled, and the input and output impedances are matched. Also, avoid capacitive loading on the output, and use a series resistor if necessary. Additionally, ensure the power supply is clean and well-regulated.
  • The maximum power dissipation of the THS4500MDGNEP is 2.5W. However, this can be affected by the ambient temperature, PCB layout, and airflow. It's essential to calculate the power dissipation based on the specific application and ensure the device is properly heat-sinked if necessary.
  • Yes, the THS4500MDGNEP can be used as a unity-gain buffer. However, it's essential to ensure the input and output impedances are matched, and the device is properly decoupled to avoid oscillations. Additionally, the output current capability should be considered to ensure the device can drive the required load.
  • To filter out high-frequency noise, you can use a low-pass filter at the input or output of the THS4500MDGNEP. A simple RC filter or a more complex active filter can be used, depending on the specific requirements of the application.

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THS4500MDGNEP Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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