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THS4500MDGNREP - Texas Instruments

Description: Differential Amplifiers EP WB,Low-Distort Fully Diff Amp

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THS4500MDGNREP - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - DGN0008D
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THS4500MDGNREP - Texas Instruments  - 3D model - Small Outline Packages - DGN0008D
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THS4500MDGNREP Details

  • Manufacturer Part Number:

    THS4500MDGNREP

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC

  • Package Description:

    MSOP-8

  • Pin Count:

    8

  • Country Of Origin:

    Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    4.6 µA

  • Bandwidth (3dB)-Nom:

    30 MHz

  • Bias Current-Max (IIB) @25C:

    4.6 µA

  • Common-mode Reject Ratio-Min:

    74 dB

  • Common-mode Reject Ratio-Nom:

    80 dB

  • Frequency Compensation:

    YES

  • Input Offset Current-Max (IIO):

    2 µA

  • Input Offset Voltage-Max:

    7000 µV

  • JESD-30 Code:

    S-PDSO-G8

  • JESD-609 Code:

    e4

  • Length:

    3 mm

  • Low-Bias:

    NO

  • Low-Offset:

    NO

  • Micropower:

    NO

  • Moisture Sensitivity Level:

    1

  • Neg Supply Voltage Limit-Max:

    -8.25 V

  • Neg Supply Voltage-Nom (Vsup):

    -15 V

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HTSSOP

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Seated Height-Max:

    1.1 mm

  • Slew Rate-Nom:

    2800 V/us

  • Supply Current-Max:

    28 mA

  • Supply Voltage Limit-Max:

    8.25 V

  • Supply Voltage-Nom (Vsup):

    15 V

  • Surface Mount:

    YES

  • Technology:

    BICMOS

  • Temperature Grade:

    MILITARY

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Unity Gain BW-Nom:

    300000

  • Voltage Gain-Min:

    282

  • Wideband:

    YES

  • Width:

    3 mm

THS4500MDGNREP Frequently Asked Questions (FAQs)

  • A good PCB layout is crucial for the THS4500MDGNREP. TI recommends a 4-layer board with a solid ground plane, and to keep the input and output traces short and symmetrical. Additionally, decoupling capacitors should be placed close to the device.
  • The gain resistor values depend on the desired gain and bandwidth. TI provides a gain resistor calculator tool to help with the selection. Generally, a lower gain resistor value results in higher bandwidth but lower gain, while a higher value results in higher gain but lower bandwidth.
  • The maximum input voltage swing is ±1.4V, which is limited by the internal clamping diodes. Exceeding this limit can cause damage to the device.
  • To minimize EMI and RFI, use a shielded enclosure, keep the device away from noise sources, and use a common-mode choke or ferrite bead on the input lines. Additionally, ensure good PCB layout practices, such as keeping the input and output traces short and symmetrical.
  • The THS4500MDGNREP has a thermal derating of 13.3 mW/°C above 25°C. This means that the maximum power dissipation decreases as the temperature increases.

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THS4500MDGNREP Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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