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THS4631DGN - Texas Instruments

Description: High Speed FET-Input Operational Amplifier

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THS4631DGN - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - DGN (S-PDSO-G8)(1)
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THS4631DGN - Texas Instruments  - 3D model - Small Outline Packages - DGN (S-PDSO-G8)(1)
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THS4631DGN Details

  • Manufacturer Part Number:

    THS4631DGN

  • Brand Name:

    Texas Instruments

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    MSOP

  • Pin Count:

    8

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    0

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    0.002 µA

  • Bandwidth (3dB)-Nom:

    25 MHz

  • Bias Current-Max (IIB) @25C:

    0.0001 µA

  • Common-mode Reject Ratio-Min:

    86 dB

  • Common-mode Reject Ratio-Nom:

    95 dB

  • Frequency Compensation:

    YES

  • Input Offset Current-Max (IIO):

    0.0001 µA

  • Input Offset Voltage-Max:

    500 µV

  • JESD-30 Code:

    S-PDSO-G8

  • JESD-609 Code:

    e4

  • Length:

    3 mm

  • Low-Bias:

    YES

  • Low-Offset:

    NO

  • Micropower:

    NO

  • Moisture Sensitivity Level:

    1

  • Neg Supply Voltage Limit-Max:

    -16.5 V

  • Neg Supply Voltage-Nom (Vsup):

    -15 V

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP8,.19

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

  • Packing Method:

    TUBE

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.1 mm

  • Slew Rate-Nom:

    1000 V/us

  • Supply Current-Max:

    13 mA

  • Supply Voltage Limit-Max:

    16.5 V

  • Supply Voltage-Nom (Vsup):

    15 V

  • Surface Mount:

    YES

  • Technology:

    BICMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Unity Gain BW-Nom:

    210000

  • Voltage Gain-Min:

    1780

  • Wideband:

    YES

  • Width:

    3 mm

THS4631DGN Frequently Asked Questions (FAQs)

  • A good PCB layout for the THS4631DGN involves keeping the input and output traces short and symmetrical, using a solid ground plane, and placing the decoupling capacitors close to the device. A 4-layer PCB with a dedicated ground plane is recommended.
  • The gain resistors (Rf and Rg) should be chosen based on the desired gain and bandwidth of the amplifier. A higher gain requires smaller resistors, while a lower gain requires larger resistors. The datasheet provides a gain resistor calculator to help with the selection.
  • The maximum power dissipation of the THS4631DGN is 1.4W. This should be taken into account when designing the thermal management of the system, especially in high-temperature or high-power applications.
  • Yes, the THS4631DGN can be used as a single-ended amplifier by tying the negative input to ground and using the positive input as the signal input. However, this will reduce the amplifier's common-mode rejection ratio and may affect its noise performance.
  • The THS4631DGN has a built-in low-pass filter that can be used to filter out high-frequency noise. Additionally, external filters such as RC filters or ferrite beads can be used to further reduce noise and electromagnetic interference.

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THS4631DGN Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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