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THS788PFDT - Texas Instruments

Description: Timers & Support Products Quad Ch Time Msmt Unit

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Symbol
THS788PFDT - Texas Instruments - PCB symbol
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PCB Footprints
THS788PFDT - Texas Instruments PCB footprint - Quad Flat Packages - Quad Flat Packages - pfd(s-pqfp-g100)
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3D Models
THS788PFDT - Texas Instruments - 3D model - Quad Flat Packages - pfd(s-pqfp-g100)
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THS788PFDT Details

  • Manufacturer Part Number:

    THS788PFDT

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Not Recommended

  • Part Package Code:

    QFP

  • Package Description:

    HTQFP-100

  • Pin Count:

    100

  • Country Of Origin:

    Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    3.9

  • Adjustable Threshold:

    NO

  • Analog IC - Other Type:

    POWER SUPPLY SUPPORT CIRCUIT

  • JESD-30 Code:

    S-PQFP-G100

  • JESD-609 Code:

    e4

  • Length:

    14 mm

  • Moisture Sensitivity Level:

    4

  • Number of Functions:

    1

  • Number of Terminals:

    100

  • Operating Temperature-Max:

    70 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HTFQFP

  • Package Equivalence Code:

    TQFP100,.63SQ

  • Package Shape:

    SQUARE

  • Package Style:

    FLATPACK

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.2 mm

  • Supply Voltage-Max (Vsup):

    3.465 V

  • Supply Voltage-Min (Vsup):

    3.135 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Temperature Grade:

    COMMERCIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    14 mm

THS788PFDT Frequently Asked Questions (FAQs)

  • A good PCB layout for the THS788PFDT involves keeping the input and output traces short and away from each other, using a solid ground plane, and placing decoupling capacitors close to the device. A 4-layer PCB with a dedicated power plane and a dedicated ground plane is recommended.
  • To ensure stability, make sure to follow the recommended PCB layout, use a low-ESR output capacitor, and add a series resistor (Rs) in the output stage. Also, ensure that the output capacitor is properly sized and placed close to the device.
  • The maximum power dissipation of the THS788PFDT is dependent on the ambient temperature and the thermal resistance of the package. According to the datasheet, the maximum power dissipation is 2.5W at 25°C ambient temperature. However, this can be derated based on the actual operating conditions.
  • The THS788PFDT is rated for operation up to 125°C junction temperature. However, the device's performance and reliability may degrade at high temperatures. It's essential to consider the thermal management and derate the power dissipation accordingly.
  • To filter out noise and ripple, add a low-pass filter (LPF) or a pi-filter (π-filter) at the output stage. The filter components should be chosen based on the specific frequency range of interest and the desired attenuation.

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THS788PFDT Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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