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THVD1330DR - Texas Instruments

Description: RS-485-IC-Schnittstelle 32-Mbps 3.3-V half-duplex RS485 transceiver with IEC ESD protection 8-SOIC -40 to 125

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THVD1330DR - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - D0008A
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THVD1330DR - Texas Instruments  - 3D model - Small Outline Packages - D0008A
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THVD1330DR Details

  • Manufacturer Part Number:

    THVD1330DR

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    SOP-8

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Differential Output:

    YES

  • Driver Number of Bits:

    1

  • High Level Input Current-Max:

    0.0005 A

  • Input Characteristics:

    DIFFERENTIAL SCHMITT TRIGGER

  • Interface IC Type:

    LINE TRANSCEIVER

  • Interface Standard:

    EIA-422; EIA-485-A; TIA-485-A

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e4

  • Length:

    4.905 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Out Swing-Min:

    1.5 V

  • Output Characteristics:

    3-STATE

  • Output Low Current-Max:

    0.008 A

  • Output Polarity:

    TRUE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Receive Delay-Max:

    25 ns

  • Receiver Number of Bits:

    1

  • Seated Height-Max:

    1.75 mm

  • Supply Current-Max:

    2 mA

  • Supply Voltage-Max:

    3.6 V

  • Supply Voltage-Min:

    3 V

  • Supply Voltage-Nom:

    3.3 V

  • Supply Voltage1-Max:

    3.6 V

  • Supply Voltage1-Min:

    3 V

  • Supply Voltage1-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    BICMOS

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transmit Delay-Max:

    16 ns

  • Width:

    3.895 mm

THVD1330DR Frequently Asked Questions (FAQs)

  • Texas Instruments provides a recommended PCB layout in the datasheet, but it's essential to note that a 4-layer PCB with a solid ground plane is recommended. Additionally, keep the signal traces short and away from the power planes to minimize noise and EMI.
  • To ensure reliable operation at high temperatures, it's crucial to follow the recommended thermal design guidelines. Ensure good thermal conductivity between the device and the PCB, and consider using thermal vias or a heat sink if necessary.
  • While the THVD1330DR has built-in ESD protection, it's essential to note that it's designed to protect against human-body model (HBM) events. Additional external ESD protection may be necessary for more stringent requirements or other ESD models.
  • Yes, the THVD1330DR is compatible with 3.3V systems. However, ensure that the input voltage is within the recommended range (VCC = 1.8V to 3.6V) and that the output voltage is within the specified range (VOUT = 1.8V to 3.3V).
  • When troubleshooting issues with the output voltage, first verify that the input voltage is within the recommended range. Then, check the output voltage is still not within the specified range, verify that the output capacitor is present and meets the recommended specifications.

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THVD1330DR Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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