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TIBPAL16R4-20MJB - Texas Instruments

Description: SPLD - Simple Programmable Logic Devices High-Performance Impact<TM> PAL<R> Circuits 20-CDIP -55 to 125

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TIBPAL16R4-20MJB - Texas Instruments PCB footprint - Ceramic Dual-In-Line Packages - Ceramic Dual-In-Line Packages - j(r-gdip-t20)
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TIBPAL16R4-20MJB Details

  • Manufacturer Part Number:

    TIBPAL16R4-20MJB

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    DIP

  • Pin Count:

    20

  • ECCN Code:

    3A001.A.2.C

  • HTS Code:

    8542.31.00.75

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Architecture:

    PAL-TYPE

  • Clock Frequency-Max:

    40 MHz

  • In-System Programmable:

    NO

  • JESD-30 Code:

    R-GDIP-T20

  • JESD-609 Code:

    e0

  • JTAG BST:

    NO

  • Length:

    24.2 mm

  • Number of Dedicated Inputs:

    8

  • Number of I/O Lines:

    4

  • Number of Inputs:

    12

  • Number of Outputs:

    8

  • Number of Product Terms:

    64

  • Number of Terminals:

    20

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Organization:

    8 DEDICATED INPUTS, 4 I/O

  • Output Function:

    MIXED

  • Package Body Material:

    CERAMIC, GLASS-SEALED

  • Package Code:

    DIP

  • Package Equivalence Code:

    DIP20,.3

  • Package Shape:

    RECTANGULAR

  • Package Style:

    IN-LINE

  • Packing Method:

    TUBE

  • Programmable Logic Type:

    OT PLD

  • Propagation Delay:

    20 ns

  • Qualification Status:

    Not Qualified

  • Screening Level:

    MIL-PRF-38535

  • Seated Height-Max:

    5.08 mm

  • Supply Voltage-Max:

    5.25 V

  • Supply Voltage-Min:

    5.25 V

  • Supply Voltage-Nom:

    5 V

  • Surface Mount:

    NO

  • Technology:

    TTL

  • Temperature Grade:

    MILITARY

  • Terminal Finish:

    Tin/Lead (Sn/Pb)

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Pitch:

    2.54 mm

  • Terminal Position:

    DUAL

  • Width:

    6.92 mm

TIBPAL16R4-20MJB Frequently Asked Questions (FAQs)

  • Texas Instruments recommends a thermal pad on the bottom of the package, connected to a solid copper plane on the PCB to dissipate heat efficiently. A minimum of 2oz copper thickness is recommended for the thermal plane.
  • To ensure reliable operation, it's essential to follow the recommended operating conditions, including voltage, current, and temperature ratings. Additionally, consider using thermal management techniques, such as heat sinks or thermal interfaces, to maintain a safe junction temperature.
  • The 'MJB' package code indicates a MicroStar Junior BGA package, which has a smaller footprint and lower thermal resistance compared to other packages. This can affect the device's thermal performance and power dissipation capabilities.
  • While the TIBPAL16R4-20MJB is a high-performance device, it may not meet the specific requirements for high-reliability or aerospace applications. Texas Instruments offers other devices with enhanced screening and qualification for these specific markets.
  • The device requires a specific power sequencing and voltage ramp-up procedure to ensure proper operation and prevent damage. Refer to the datasheet and application notes for detailed guidelines on power-up and power-down sequences.

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TIBPAL16R4-20MJB Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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TIBPAL16R4-20MJB Alternates

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Part Image 5962-8515504RX Monolithic Memories Inc (MMI)

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For a full list of alternate parts for TIBPAL16R4-20MJB, check out Findchips.com