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TIC10024QDCPRQ1 - Texas Instruments

Description: Automotive 24-Input Multiple-Switch Detection With SPI Interface

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TIC10024QDCPRQ1 - Texas Instruments - PCB symbol
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TIC10024QDCPRQ1 - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - DCP0038A
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TIC10024QDCPRQ1 - Texas Instruments - 3D model - Small Outline Packages - DCP0038A
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TIC10024QDCPRQ1 Details

  • Manufacturer Part Number:

    TIC10024QDCPRQ1

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Date Of Intro:

    2017-09-25

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Adjustable Threshold:

    YES

  • Analog IC - Other Type:

    LOAD SWITCH

  • JESD-30 Code:

    R-PDSO-G38

  • JESD-609 Code:

    e4

  • Length:

    9.7 mm

  • Moisture Sensitivity Level:

    3

  • Number of Channels:

    24

  • Number of Functions:

    1

  • Number of Terminals:

    38

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HTSSOP

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    1.2 mm

  • Supply Current-Max (Isup):

    7 mA

  • Supply Voltage-Max (Vsup):

    35 V

  • Supply Voltage-Min (Vsup):

    4.5 V

  • Supply Voltage-Nom (Vsup):

    12 V

  • Surface Mount:

    YES

  • Technology:

    BICMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Threshold Voltage-Nom:

    +3.7V

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    4.4 mm

TIC10024QDCPRQ1 Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and thermal vias is recommended for optimal thermal performance. The device should be placed near a thermal pad or heat sink to dissipate heat efficiently.
  • Ensure that the device is operated within the recommended voltage and current limits, and that the PCB is designed to minimize thermal gradients. Additionally, consider using thermal protection circuits and over-temperature shutdown mechanisms to prevent damage.
  • Exceeding the maximum junction temperature can lead to reduced device lifespan, increased thermal resistance, and potentially catastrophic failure. It is essential to ensure that the device operates within the recommended temperature range to maintain reliability and performance.
  • Implement ESD protection measures such as using ESD-protected ICs, adding ESD diodes, and following proper handling and storage procedures to prevent damage from electrostatic discharge.
  • Follow standard PCB assembly and rework procedures, ensuring that the device is handled by trained personnel, and that the PCB is cleaned and dried properly after assembly to prevent moisture damage.

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TIC10024QDCPRQ1 Overview

Use the download button to access the TIC10024QDCPRQ1 schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like TIC10, or try a keyword search, such as Power Management Circuits

About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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