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TL16PIR552PH - Texas Instruments

Description: Texas Instruments Dual-Channel, PQFP Universal Asynchronous Receiver & Transmitter IrDA 1MBd, 5 V, 80-Pin TL16PIR552PH

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PCB Footprints
TL16PIR552PH - Texas Instruments PCB footprint - Quad Flat Packages - Quad Flat Packages - PH(R-PQFP-G80)
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TL16PIR552PH - Texas Instruments  - 3D model - Quad Flat Packages - PH(R-PQFP-G80)
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TL16PIR552PH Details

  • Manufacturer Part Number:

    TL16PIR552PH

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    QFP

  • Package Description:

    GREEN, PLASTIC, QFP-80

  • Pin Count:

    80

  • HTS Code:

    8542.31.00.30

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    0

  • Address Bus Width:

    3

  • Boundary Scan:

    NO

  • Bus Compatibility:

    IBM PC-AT

  • Clock Frequency-Max:

    16 MHz

  • Communication Protocol:

    ASYNC, BIT

  • Data Transfer Rate-Max:

    0.125 MBps

  • External Data Bus Width:

    8

  • JESD-30 Code:

    R-PQFP-G80

  • JESD-609 Code:

    e4

  • Length:

    20 mm

  • Low Power Mode:

    NO

  • Moisture Sensitivity Level:

    3

  • Number of Serial I/Os:

    2

  • Number of Terminals:

    80

  • Operating Temperature-Max:

    70 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    QFP

  • Package Equivalence Code:

    QFP80,.7X.9,32

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLATPACK

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    3.1 mm

  • Supply Voltage-Max:

    5.25 V

  • Supply Voltage-Min:

    4.75 V

  • Supply Voltage-Nom:

    5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    COMMERCIAL

  • Terminal Finish:

    NICKEL PALLADIUM GOLD

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.8 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    14 mm

  • uPs/uCs/Peripheral ICs Type:

    SERIAL IO/COMMUNICATION CONTROLLER, SERIAL

TL16PIR552PH Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. Ensure a minimum of 1 oz copper thickness and a thermal relief pattern around the device.
  • Implement a robust thermal management system, including a heat sink and thermal interface material. Ensure proper PCB design, and consider using a thermistor or thermocouple for temperature monitoring.
  • Use a shielded enclosure, and ensure proper PCB layout and routing. Implement EMI filters, and consider using a common-mode choke or ferrite beads to reduce emissions.
  • Implement a power-saving mode, and consider using a low-dropout regulator or a switching regulator. Optimize the system's clock frequency and voltage supply, and use power-gating techniques.
  • Use a 4-wire Kelvin connection for accurate voltage and current measurements. Implement a test fixture with a thermocouple or thermistor for temperature monitoring, and consider using a logic analyzer or oscilloscope for signal analysis.

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TL16PIR552PH Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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