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TLC27M2BID - Texas Instruments

Description: Texas Instruments TLC27M2BID, Dual Op Amp, 0.525MHz CMOS, 5 → 15 V, 8-Pin SOIC

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TLC27M2BID - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - D0008A
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TLC27M2BID - Texas Instruments  - 3D model - Small Outline Packages - D0008A
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TLC27M2BID Details

  • Manufacturer Part Number:

    TLC27M2BID

  • Brand Name:

    Texas Instruments

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    SOIC

  • Pin Count:

    8

  • Country Of Origin:

    Mexico, Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    0

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    0.002 µA

  • Bias Current-Max (IIB) @25C:

    0.00006 µA

  • Common-mode Reject Ratio-Min:

    65 dB

  • Common-mode Reject Ratio-Nom:

    91 dB

  • Frequency Compensation:

    YES

  • Input Offset Current-Max (IIO):

    0.00006 µA

  • Input Offset Voltage-Max:

    2000 µV

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e4

  • Length:

    4.9 mm

  • Low-Bias:

    YES

  • Low-Offset:

    NO

  • Micropower:

    YES

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    2

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Packing Method:

    TUBE

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.75 mm

  • Slew Rate-Nom:

    0.46 V/us

  • Subcategory:

    Operational Amplifier

  • Supply Current-Max:

    0.9 mA

  • Supply Voltage Limit-Max:

    18 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Unity Gain BW-Nom:

    525

  • Voltage Gain-Min:

    25000

  • Wideband:

    NO

  • Width:

    3.9 mm

TLC27M2BID Frequently Asked Questions (FAQs)

  • The maximum power dissipation of TLC27M2BID is 670mW, which is calculated based on the maximum junction temperature (TJ) of 150°C and thermal resistance (RθJA) of 125°C/W.
  • To ensure stability in the TLC27M2BID op-amp, it's essential to follow proper PCB layout practices, such as minimizing parasitic capacitance and inductance, using a low-ESR capacitor for decoupling, and avoiding high-gain configurations.
  • While TLC27M2BID is an op-amp, it can be used as a comparator in certain applications. However, it's essential to note that the device is not optimized for comparator operation, and its performance may not be as good as a dedicated comparator. Additionally, the output stage is not designed to drive low-impedance loads.
  • The input impedance of TLC27M2BID is typically around 10^12 ohms in parallel with 10pF, which is relatively high. This makes the device suitable for applications where high input impedance is required, such as in audio and sensor circuits.
  • TLC27M2BID has built-in ESD protection, but it's still essential to follow proper handling and storage procedures to prevent damage. Additionally, it's recommended to use ESD protection devices, such as TVS diodes, in the circuit to provide additional protection.

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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