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TLC27M2BIDR - Texas Instruments

Description: LinCMOS™ Precision Dual Operational Amplifier

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TLC27M2BIDR - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - D0008A
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TLC27M2BIDR - Texas Instruments  - 3D model - Small Outline Packages - D0008A
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TLC27M2BIDR Details

  • Manufacturer Part Number:

    TLC27M2BIDR

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC

  • Pin Count:

    8

  • Country Of Origin:

    Mainland China, Malaysia, Mexico, Taiwan, Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    0.002 µA

  • Bias Current-Max (IIB) @25C:

    0.00006 µA

  • Common-mode Reject Ratio-Min:

    65 dB

  • Common-mode Reject Ratio-Nom:

    91 dB

  • Frequency Compensation:

    YES

  • Input Offset Current-Max (IIO):

    0.00006 µA

  • Input Offset Voltage-Max:

    2000 µV

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e4

  • Length:

    4.9 mm

  • Low-Bias:

    YES

  • Low-Offset:

    NO

  • Micropower:

    YES

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    2

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.75 mm

  • Slew Rate-Nom:

    0.46 V/us

  • Subcategory:

    Operational Amplifier

  • Supply Current-Max:

    0.9 mA

  • Supply Voltage Limit-Max:

    18 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Unity Gain BW-Nom:

    525

  • Voltage Gain-Min:

    25000

  • Wideband:

    NO

  • Width:

    3.9 mm

TLC27M2BIDR Frequently Asked Questions (FAQs)

  • The maximum power dissipation of TLC27M2BIDR is 670mW, which is calculated based on the package thermal resistance and the maximum junction temperature.
  • To ensure stability in the TLC27M2BIDR op-amp, it's essential to follow proper PCB layout practices, use a bypass capacitor between the supply pins, and avoid capacitive loads. Additionally, the datasheet recommends using a 10nF capacitor in parallel with a 1kΩ resistor between the output and the inverting input to improve stability.
  • The recommended operating voltage range for TLC27M2BIDR is 4.75V to 16V, with a maximum rating of 18V. Operating the device outside this range may affect its performance and reliability.
  • The TLC27M2BIDR is rated for operation from -40°C to 125°C. However, the device's performance and reliability may degrade at higher temperatures. It's essential to consider the thermal management and heat dissipation in the system design to ensure reliable operation.
  • To prevent electrostatic discharge (ESD) damage, it's essential to follow proper handling and storage procedures. Use an anti-static wrist strap, mat, or workstation, and avoid touching the device's pins. The TLC27M2BIDR has built-in ESD protection, but it's still important to take precautions to prevent damage.

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TLC27M2BIDR Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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