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TLE2426MDG4 - Texas Instruments

Description: V-Ref Adjustable 2V to 20V 20mA 8-Pin SOIC T/R

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TLE2426MDG4 - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - D0008A
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TLE2426MDG4 - Texas Instruments  - 3D model - Small Outline Packages - D0008A
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TLE2426MDG4 Details

  • Manufacturer Part Number:

    TLE2426MDG4

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    SOIC

  • Package Description:

    SOIC-8

  • Pin Count:

    8

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    0

  • Analog IC - Other Type:

    ANALOG CIRCUIT

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e4

  • Length:

    4.9 mm

  • Moisture Sensitivity Level:

    1

  • Number of Channels:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.75 mm

  • Supply Current-Max (Isup):

    0.25 mA

  • Supply Voltage-Max (Vsup):

    40 V

  • Supply Voltage-Min (Vsup):

    4 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Temperature Grade:

    MILITARY

  • Terminal Finish:

    NICKEL PALLADIUM GOLD

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3.9 mm

TLE2426MDG4 Frequently Asked Questions (FAQs)

  • The recommended layout and placement for the TLE2426MDG4 involves keeping the device close to the power supply, using short traces, and avoiding vias under the device to minimize noise and ensure proper operation. A good layout practice is to place the device near the power supply, with the input pins facing the power supply and the output pins facing the load.
  • The TLE2426MDG4 has a thermal pad that must be connected to a thermal plane on the PCB to ensure proper heat dissipation. A thermal via or a thermal pad on the PCB is recommended to dissipate heat away from the device. Additionally, the device should be placed in a location with good airflow to prevent overheating.
  • The TLE2426MDG4 can handle input voltages up to 40V, but it is recommended to operate the device within the specified input voltage range of 3.5V to 36V to ensure proper operation and to prevent damage to the device.
  • While the TLE2426MDG4 can be used as a voltage regulator, it is not recommended as it is not designed for that purpose. The device is intended to be used as a rail-to-rail operational amplifier, and using it as a voltage regulator may not provide the desired performance and stability.
  • To ensure the stability of the TLE2426MDG4, it is recommended to follow the recommended circuit layout and component selection guidelines, use a stable input voltage, and ensure that the device is operated within its specified temperature range. Additionally, the device should be decoupled with a capacitor to prevent oscillations and ensure stable operation.

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TLE2426MDG4 Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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