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TLK2711AIRCPRG4 - Texas Instruments

Description: Serializers & Deserializers - Serdes 1.6 to 2.7 GBPS Xcvr

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TLK2711AIRCPRG4 - Texas Instruments - PCB symbol
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PCB Footprints
TLK2711AIRCPRG4 - Texas Instruments PCB footprint - Quad Flat Packages - Quad Flat Packages - RCP (S-PQFP-G64)
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3D Models
TLK2711AIRCPRG4 - Texas Instruments - 3D model - Quad Flat Packages - RCP (S-PQFP-G64)
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TLK2711AIRCPRG4 Details

  • Manufacturer Part Number:

    TLK2711AIRCPRG4

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    QFP

  • Package Description:

    GREEN, PLASTIC, HVQFP-64

  • Pin Count:

    64

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    0

  • JESD-30 Code:

    S-PQFP-G64

  • JESD-609 Code:

    e4

  • Length:

    10 mm

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    64

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVFQFP

  • Package Equivalence Code:

    TQFP64,.47SQ

  • Package Shape:

    SQUARE

  • Package Style:

    FLATPACK, HEAT SINK/SLUG, VERY THIN PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1 mm

  • Supply Voltage-Nom:

    2.5 V

  • Surface Mount:

    YES

  • Telecom IC Type:

    TELECOM CIRCUIT

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    NICKEL PALLADIUM GOLD

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    10 mm

TLK2711AIRCPRG4 Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and a separate power plane is recommended. Keep the analog and digital sections separate, and use a common ground point for the analog and digital grounds.
  • Ensure good thermal design, use a heat sink if necessary, and follow the recommended operating conditions. Also, consider using a thermal interface material to improve heat transfer.
  • Use a shielded enclosure, keep the PCB layout compact, and use EMI filters or common-mode chokes on the input and output lines. Also, ensure good grounding and decoupling.
  • Use a logic analyzer or oscilloscope to monitor the signals, check the power supply and clock signals, and verify the configuration and programming of the device. Consult the datasheet and application notes for troubleshooting guides.
  • Ensure proper power sequencing, use level shifters or voltage translators if necessary, and consider using a power management IC to manage the power domains.

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TLK2711AIRCPRG4 Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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