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TLV1704AMPWPSEP - Texas Instruments

Description: 2.2-V to 36-V, radiation hardened microPower quad comparator in space enhanced plastic

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TLV1704AMPWPSEP - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - PW
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TLV1704AMPWPSEP Details

  • Manufacturer Part Number:

    TLV1704AMPWPSEP

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Date Of Intro:

    2018-11-11

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Amplifier Type:

    COMPARATOR

  • Average Bias Current-Max (IIB):

    0.02 µA

  • Bias Current-Max (IIB) @25C:

    0.015 µA

  • Input Offset Voltage-Max:

    2500 µV

  • JESD-30 Code:

    R-PDSO-G14

  • JESD-609 Code:

    e4

  • Length:

    5 mm

  • Moisture Sensitivity Level:

    2

  • Number of Functions:

    4

  • Number of Terminals:

    14

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Output Type:

    OPEN-COLLECTOR; OPEN-DRAIN

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Packing Method:

    TUBE

  • Peak Reflow Temperature (Cel):

    260

  • Response Time-Nom:

    560 ns

  • Seated Height-Max:

    1.2 mm

  • Supply Voltage Limit-Max:

    40 V

  • Surface Mount:

    YES

  • Technology:

    BIPOLAR

  • Temperature Grade:

    MILITARY

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    4.4 mm

TLV1704AMPWPSEP Frequently Asked Questions (FAQs)

  • A good PCB layout for the TLV1704 involves keeping the input and output traces short and away from each other, using a solid ground plane, and placing decoupling capacitors close to the device. A 4-layer PCB with a dedicated ground plane is recommended.
  • To ensure stability in the TLV1704, make sure to follow the recommended component values and PCB layout guidelines. Additionally, use a compensation capacitor (Cc) between the output and inverting input pins, and ensure the gain-setting resistors (Rf and Rg) are properly matched.
  • The maximum power dissipation of the TLV1704 is dependent on the ambient temperature and the thermal resistance of the package. For the WQFN package, the maximum power dissipation is approximately 1.4W at 25°C ambient temperature.
  • Yes, the TLV1704 can be used as a unity-gain buffer by connecting the output directly to the inverting input pin. However, this configuration may require additional compensation to ensure stability.
  • The TLV1704 has built-in ESD protection, but it's still recommended to follow proper ESD handling procedures when handling the device. Use an ESD wrist strap or mat, and ensure the PCB is properly grounded.

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TLV1704AMPWPSEP Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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