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TLV2370IDBVT - Texas Instruments

Description: Texas Instruments TLV2370IDBVT Op Amp, 3MHz Rail-Rail, 3 → 15 V, 6-Pin SOT-23

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PCB Footprints
TLV2370IDBVT - Texas Instruments PCB footprint - SOT23 (6-Pin) - SOT23 (6-Pin) - DBV0006A
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3D Models
TLV2370IDBVT - Texas Instruments  - 3D model - SOT23 (6-Pin) - DBV0006A
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TLV2370IDBVT Details

  • Manufacturer Part Number:

    TLV2370IDBVT

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOT-23

  • Pin Count:

    6

  • Country Of Origin:

    Mainland China, Malaysia, Philippines, Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    0.00006 µA

  • Bias Current-Max (IIB) @25C:

    0.00006 µA

  • Common-mode Reject Ratio-Min:

    55 dB

  • Common-mode Reject Ratio-Nom:

    72 dB

  • Frequency Compensation:

    YES

  • Input Offset Current-Max (IIO):

    0.00006 µA

  • Input Offset Voltage-Max:

    4500 µV

  • JESD-30 Code:

    R-PDSO-G6

  • JESD-609 Code:

    e4

  • Length:

    2.9 mm

  • Low-Bias:

    YES

  • Low-Offset:

    NO

  • Micropower:

    NO

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    6

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LSSOP

  • Package Equivalence Code:

    TSOP6,.11,37

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.45 mm

  • Slew Rate-Min:

    1 V/us

  • Slew Rate-Nom:

    2.4 V/us

  • Subcategory:

    Operational Amplifier

  • Supply Current-Max:

    0.66 mA

  • Supply Voltage Limit-Max:

    16.5 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.95 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Unity Gain BW-Nom:

    3000

  • Voltage Gain-Min:

    79432

  • Wideband:

    YES

  • Width:

    1.6 mm

TLV2370IDBVT Frequently Asked Questions (FAQs)

  • The maximum power dissipation of the TLV2370IDBVT is 670mW, which is calculated based on the maximum junction temperature (TJ) of 150°C and the thermal resistance (θJA) of 125°C/W.
  • To ensure stability, it's essential to follow proper PCB layout practices, use a low-ESR capacitor for decoupling, and avoid using long traces or wires that can introduce parasitic inductance. Additionally, consider adding a small capacitor (e.g., 10nF) in parallel with the feedback resistor to improve stability.
  • The recommended operating voltage range for the TLV2370IDBVT is 2.7V to 5.5V. Operating the device outside this range may affect its performance and reliability.
  • The TLV2370IDBVT is rated for operation up to 125°C. However, it's essential to consider the device's power dissipation and thermal management when operating in high-temperature environments to avoid overheating and ensure reliable operation.
  • When selecting an output capacitor, consider the capacitor's equivalent series resistance (ESR), capacitance value, and voltage rating. A low-ESR capacitor (e.g., ceramic or film capacitor) with a value between 10nF to 100nF is typically suitable for most applications.

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TLV2370IDBVT Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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