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TLV2371MDBVREP - Texas Instruments

Description: Enhanced Product 550-Ua/Ch 3-Mhz Rail-To-Rail Input/Output Operational Amplifiers

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TLV2371MDBVREP - Texas Instruments PCB footprint - SOT23 (5-Pin) - SOT23 (5-Pin) - DBV0005A
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TLV2371MDBVREP - Texas Instruments  - 3D model - SOT23 (5-Pin) - DBV0005A
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TLV2371MDBVREP Details

  • Manufacturer Part Number:

    TLV2371MDBVREP

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    SOT-23

  • Package Description:

    SOT-23, 5 PIN

  • Pin Count:

    5

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    0

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    0.001 µA

  • Bias Current-Max (IIB) @25C:

    0.00006 µA

  • Common-mode Reject Ratio-Min:

    54 dB

  • Common-mode Reject Ratio-Nom:

    72 dB

  • Frequency Compensation:

    YES

  • Input Offset Current-Max (IIO):

    0.00006 µA

  • Input Offset Voltage-Max:

    4500 µV

  • JESD-30 Code:

    R-PDSO-G5

  • JESD-609 Code:

    e4

  • Length:

    2.9 mm

  • Low-Bias:

    YES

  • Low-Offset:

    NO

  • Micropower:

    NO

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    5

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LSSOP

  • Package Equivalence Code:

    TSOP5/6,.11,37

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

  • Packing Method:

    TR, 7 INCH

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.45 mm

  • Slew Rate-Min:

    1 V/us

  • Slew Rate-Nom:

    2.4 V/us

  • Supply Current-Max:

    1.2 mA

  • Supply Voltage Limit-Max:

    16.5 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Technology:

    BICMOS

  • Temperature Grade:

    MILITARY

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.95 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Unity Gain BW-Nom:

    3000

  • Voltage Gain-Min:

    10000

  • Wideband:

    NO

  • Width:

    1.6 mm

TLV2371MDBVREP Frequently Asked Questions (FAQs)

  • A good PCB layout for TLV2371MDBVREP involves keeping the input and output traces short and separate, using a solid ground plane, and placing decoupling capacitors close to the device. TI provides a recommended layout in the datasheet and application notes.
  • To ensure stability, ensure that the output capacitor is properly sized, and the feedback resistors are chosen to maintain a gain-bandwidth product within the device's specifications. Additionally, use a low-ESR output capacitor and minimize parasitic inductance in the output stage.
  • The maximum input voltage for TLV2371MDBVREP is 6V, but it's recommended to keep the input voltage below 5.5V to ensure reliable operation and prevent damage to the device.
  • TLV2371MDBVREP is rated for operation up to 125°C, but its performance may degrade at high temperatures. Ensure that the device is properly heat-sinked and follow TI's guidelines for high-temperature operation.
  • Start by verifying the power supply voltage, checking for proper decoupling, and ensuring that the input and output stages are properly biased. Use an oscilloscope to check for oscillations or abnormal waveforms, and consult TI's application notes and datasheet for troubleshooting guides.

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TLV2371MDBVREP Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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