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TLV2371QDBVRQ1 - Texas Instruments

Description: Automotive 550-uA/Ch 3-MHz Rail-to-Rail Input/Output Operational Amplifiers

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TLV2371QDBVRQ1 - Texas Instruments PCB footprint - SOT23 (5-Pin) - SOT23 (5-Pin) - DBV0005A
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TLV2371QDBVRQ1 - Texas Instruments  - 3D model - SOT23 (5-Pin) - DBV0005A
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TLV2371QDBVRQ1 Details

  • Manufacturer Part Number:

    TLV2371QDBVRQ1

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOT-23

  • Pin Count:

    5

  • Country Of Origin:

    Taiwan, Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    0.00006 µA

  • Bias Current-Max (IIB) @25C:

    0.00006 µA

  • Common-mode Reject Ratio-Min:

    55 dB

  • Common-mode Reject Ratio-Nom:

    72 dB

  • Frequency Compensation:

    YES

  • Input Offset Current-Max (IIO):

    0.00006 µA

  • Input Offset Voltage-Max:

    4500 µV

  • JESD-30 Code:

    R-PDSO-G5

  • JESD-609 Code:

    e3

  • Length:

    2.9 mm

  • Low-Bias:

    YES

  • Low-Offset:

    NO

  • Micropower:

    NO

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    5

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LSSOP

  • Package Equivalence Code:

    TSOP5/6,.11,37

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Qualification Status:

    Not Qualified

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    1.45 mm

  • Slew Rate-Min:

    1 V/us

  • Slew Rate-Nom:

    2.4 V/us

  • Supply Current-Max:

    0.66 mA

  • Supply Voltage Limit-Max:

    16.5 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.95 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Unity Gain BW-Nom:

    3000

  • Voltage Gain-Min:

    56234

  • Wideband:

    NO

  • Width:

    1.6 mm

TLV2371QDBVRQ1 Frequently Asked Questions (FAQs)

  • A good PCB layout for the TLV2371QDBVRQ1 involves keeping the input and output traces separate, using a solid ground plane, and placing decoupling capacitors close to the device. Additionally, it's recommended to use a star-ground configuration and to avoid routing high-frequency signals near the device.
  • To ensure the TLV2371QDBVRQ1 operates within its recommended operating conditions, verify that the supply voltage is within the specified range (2.7V to 5.5V), the input common-mode voltage is within the specified range (VCC-1.5V to VCC-0.5V), and the output current is within the specified range (±50mA).
  • The recommended decoupling capacitor value for the TLV2371QDBVRQ1 is 0.1uF to 1uF, with a voltage rating that matches the supply voltage. Place the capacitor as close to the device as possible, with the shortest possible leads.
  • To handle ESD protection for the TLV2371QDBVRQ1, use a TVS (Transient Voltage Suppressor) diode or a dedicated ESD protection device, such as the Texas Instruments TPD1E05U06. Ensure the ESD protection device is connected between the input pins and the power supply pins.
  • The thermal impedance of the TLV2371QDBVRQ1 package (QDBVR) is approximately 45°C/W (junction-to-ambient thermal resistance). This value can be used to estimate the junction temperature of the device under different operating conditions.

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TLV2371QDBVRQ1 Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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