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TLV2373ID - Texas Instruments

Description: Texas Instruments TLV2373ID, Dual Op Amp, 3MHz Rail-Rail, 3 → 15 V, 14-Pin SOIC

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TLV2373ID - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - D(R-PDSO-G14)-2021
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TLV2373ID - Texas Instruments  - 3D model - Small Outline Packages - D(R-PDSO-G14)-2021
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TLV2373ID Details

  • Manufacturer Part Number:

    TLV2373ID

  • Brand Name:

    Texas Instruments

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    SOIC

  • Pin Count:

    14

  • Country Of Origin:

    Mexico

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    0

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    0.00006 µA

  • Bias Current-Max (IIB) @25C:

    0.00006 µA

  • Common-mode Reject Ratio-Min:

    55 dB

  • Common-mode Reject Ratio-Nom:

    72 dB

  • Frequency Compensation:

    YES

  • Input Offset Current-Max (IIO):

    0.00006 µA

  • Input Offset Voltage-Max:

    4500 µV

  • JESD-30 Code:

    R-PDSO-G14

  • JESD-609 Code:

    e4

  • Length:

    8.65 mm

  • Low-Bias:

    YES

  • Low-Offset:

    NO

  • Micropower:

    NO

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    2

  • Number of Terminals:

    14

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP14,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Packing Method:

    TUBE

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.75 mm

  • Slew Rate-Min:

    1 V/us

  • Slew Rate-Nom:

    2.4 V/us

  • Subcategory:

    Operational Amplifier

  • Supply Current-Max:

    1.32 mA

  • Supply Voltage Limit-Max:

    16.5 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Unity Gain BW-Nom:

    3000

  • Voltage Gain-Min:

    79432

  • Wideband:

    YES

  • Width:

    3.9 mm

TLV2373ID Frequently Asked Questions (FAQs)

  • The maximum power dissipation of TLV2373ID is 670mW, which is calculated based on the maximum junction temperature (TJ) of 150°C and thermal resistance (RθJA) of 125°C/W.
  • To ensure stability in the TLV2373ID op-amp, it is recommended to use a minimum gain of 7, and to avoid capacitive loads greater than 100pF. Additionally, a 10nF to 100nF capacitor can be added between the output and the inverting input to improve stability.
  • For optimal performance, it is recommended to use a symmetrical layout, keep the input and output traces short and away from noise sources, and use a ground plane to reduce noise and electromagnetic interference (EMI).
  • Yes, TLV2373ID is rated for operation from -40°C to 125°C, making it suitable for high-temperature environments. However, the device's performance and reliability may degrade at extreme temperatures, so it is essential to consider the specific application requirements and potential derating.
  • To protect TLV2373ID from ESD, it is recommended to handle the device with anti-static wrist straps, mats, or bags, and to use ESD-sensitive devices handling procedures. Additionally, the device's pins should be connected to a ground plane or a low-impedance path to discharge static electricity.

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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