Part Image

TLV2452IDGKR - Texas Instruments

Description: Dual Micropower Rail-To-Rail Input/Output Op Amp

Download TLV2452IDGKR Model
Schematic
symbols
Schematic symbol is unavailable for download
PCB
footprints
PCB footprint is unavailable for download
3D
models
3D model is unavailable for download
PCB Footprints
TLV2452IDGKR - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - DGK  (S-PDSO-G8)
click to zoom
3D Models
TLV2452IDGKR - Texas Instruments  - 3D model - Small Outline Packages - DGK  (S-PDSO-G8)
click to zoom

TLV2452IDGKR Details

  • Manufacturer Part Number:

    TLV2452IDGKR

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    MSOP

  • Pin Count:

    8

  • Country Of Origin:

    Mainland China, Philippines, Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    0.007 µA

  • Bias Current-Max (IIB) @25C:

    0.005 µA

  • Common-mode Reject Ratio-Min:

    70 dB

  • Common-mode Reject Ratio-Nom:

    80 dB

  • Frequency Compensation:

    YES

  • Input Offset Current-Max (IIO):

    0.00045 µA

  • Input Offset Voltage-Max:

    1500 µV

  • JESD-30 Code:

    S-PDSO-G8

  • JESD-609 Code:

    e4

  • Length:

    3 mm

  • Low-Bias:

    NO

  • Low-Offset:

    NO

  • Micropower:

    YES

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    2

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP8,.19

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.1 mm

  • Slew Rate-Min:

    0.02 V/us

  • Slew Rate-Nom:

    0.11 V/us

  • Subcategory:

    Operational Amplifier

  • Supply Current-Max:

    0.084 mA

  • Supply Voltage Limit-Max:

    7 V

  • Supply Voltage-Nom (Vsup):

    3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Unity Gain BW-Nom:

    220

  • Voltage Gain-Min:

    63095

  • Wideband:

    NO

  • Width:

    3 mm

TLV2452IDGKR Frequently Asked Questions (FAQs)

  • Texas Instruments recommends a star-ground topology and a 4-layer PCB with a solid ground plane to minimize noise. Additionally, keep analog and digital traces separate, and use a common ground point for the device.
  • Power sequencing is critical for the TLV2452IDGKR. TI recommends powering the device in the following sequence: VCC, AVCC, and then DVCC. Ensure that the power supplies are turned on in the correct sequence to prevent damage to the device.
  • TI recommends using a 0.1uF ceramic capacitor between VCC and GND, and a 10uF tantalum capacitor between AVCC and GND. Additionally, use a 0.01uF capacitor between DVCC and GND for digital noise filtering.
  • Ensure that the device operates within its recommended operating temperature range (-40°C to 125°C). Use thermal management techniques such as heat sinks, thermal interfaces, and airflow management to keep the device within its operating temperature range.
  • Common pitfalls to avoid include: not following the recommended power sequencing, not using adequate decoupling capacitors, not providing a solid ground plane, and not following the recommended layout and routing guidelines.

Trust Checks

This model has been provided by community users.
Community Provided
This model has been verified by system checks.
System Verified
This model has been reviewed by community users.
Community Approved
Sponsored

TLV2452IDGKR Overview

Use the download button to access the TLV2452IDGKR schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like TLV24, or try a keyword search, such as Operational Amplifiers

About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

Parts related to TLV2452IDGKR

Showing 0 results

TLV2452IDGKR Alternates

Showing results

Image Part Number Model
Part Image TLV2452IDGK Texas Instruments

Operational Amplifier, 2 Func, 1500uV Offset-Max, CMOS, PDSO8

Part Image TLV2452IDGKG4 Texas Instruments

Operational Amplifier, 2 Func, 2000uV Offset-Max, CMOS, PDSO8

Part Image TLV2452IDGKRG4 Texas Instruments

Operational Amplifier, 2 Func, 1500uV Offset-Max, CMOS, PDSO8