Part Image

TLV2461IDR - Texas Instruments

Description: Texas Instruments TLV2461IDR Op Amp, 6.4MHz Rail-Rail, 3 V, 5 V, 8-Pin SOIC

Download TLV2461IDR Model
Schematic
symbols
Schematic symbol is unavailable for download
PCB
footprints
PCB footprint is unavailable for download
3D
models
3D model is unavailable for download
PCB Footprints
TLV2461IDR - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - +soic d
click to zoom
3D Models
TLV2461IDR - Texas Instruments  - 3D model - Small Outline Packages - +soic d
click to zoom

TLV2461IDR Details

  • Manufacturer Part Number:

    TLV2461IDR

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC

  • Pin Count:

    8

  • Country Of Origin:

    Mainland China, Mexico, Philippines, Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    0.075 µA

  • Bias Current-Max (IIB) @25C:

    0.014 µA

  • Common-mode Reject Ratio-Min:

    71 dB

  • Common-mode Reject Ratio-Nom:

    85 dB

  • Frequency Compensation:

    YES

  • Input Offset Current-Max (IIO):

    0.007 µA

  • Input Offset Voltage-Max:

    2000 µV

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e4

  • Length:

    4.9 mm

  • Low-Bias:

    NO

  • Low-Offset:

    NO

  • Micropower:

    NO

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.75 mm

  • Slew Rate-Min:

    0.8 V/us

  • Slew Rate-Nom:

    1.6 V/us

  • Subcategory:

    Operational Amplifier

  • Supply Current-Max:

    0.65 mA

  • Supply Voltage Limit-Max:

    6 V

  • Supply Voltage-Nom (Vsup):

    3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Unity Gain BW-Nom:

    6400

  • Voltage Gain-Min:

    31622

  • Wideband:

    NO

  • Width:

    3.9 mm

TLV2461IDR Frequently Asked Questions (FAQs)

  • The maximum power dissipation of the TLV2461IDR is dependent on the package type and ambient temperature. For the SOIC package, the maximum power dissipation is 670mW at 25°C. For the VSSOP package, it is 440mW at 25°C. Refer to the thermal characteristics table in the datasheet for more information.
  • To ensure stability in a unity-gain buffer configuration, make sure to use a bypass capacitor between the VCC pin and ground, and a decoupling capacitor between the VCC pin and the output pin. The recommended values are 0.1uF and 10nF, respectively. Additionally, ensure that the layout is well-designed to minimize parasitic inductance and capacitance.
  • The recommended input impedance for the TLV2461IDR is greater than 1kΩ to ensure optimal performance. Lower input impedances can lead to reduced bandwidth and increased distortion.
  • While the TLV2461IDR can be used as a comparator, it is not recommended due to its relatively slow slew rate (0.5V/μs) and limited output current (±20mA). Texas Instruments recommends using a dedicated comparator device, such as the TLV7031, for comparator applications.
  • The TLV2461IDR has built-in ESD protection, but it is still recommended to follow proper ESD handling procedures when handling the device. Use an ESD wrist strap or mat, and ensure that the device is stored in an ESD-protected package.

Trust Checks

This model has been provided by community users.
Community Provided
This model has been verified by system checks.
System Verified
This model has been reviewed by community users.
Community Approved
Sponsored

TLV2461IDR Overview

Use the download button to access the TLV2461IDR schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like TLV24, or try a keyword search, such as Operational Amplifiers

About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

Parts related to TLV2461IDR

Showing 0 results

TLV2461IDR Alternates

Showing results

Image Part Number Model
Part Image TLV2461QDRG4 Rochester Electronics LLC

OP-AMP, 2200uV OFFSET-MAX, 5.2MHz BAND WIDTH, PDSO8, GREEN, PLASTIC, MS-012AA, SOIC-8

Part Image TLV2461IDR Rochester Electronics LLC

OP-AMP, 2200uV OFFSET-MAX, 5.2MHz BAND WIDTH, PDSO8, GREEN, PLASTIC, MS-012AA, SOIC-8

Part Image TLV2461QDRG4 Texas Instruments

Operational Amplifier, 1 Func, 2200uV Offset-Max, CMOS, PDSO8

Part Image TLV2461QDG4 Texas Instruments

Operational Amplifier, 1 Func, 2200uV Offset-Max, CMOS, PDSO8

Part Image TLV2461QD Texas Instruments

Operational Amplifier, 1 Func, 2200uV Offset-Max, CMOS, PDSO8

For a full list of alternate parts for TLV2461IDR, check out Findchips.com