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TLV2760IDBVTG4 - Texas Instruments

Description: Operational Amplifiers - Op Amps Sngl 1.8-V Micropwr R-to-R Single Sply

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TLV2760IDBVTG4 - Texas Instruments PCB footprint - SOT23 (6-Pin) - SOT23 (6-Pin) - DBV0006A
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3D Models
TLV2760IDBVTG4 - Texas Instruments  - 3D model - SOT23 (6-Pin) - DBV0006A
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TLV2760IDBVTG4 Details

  • Manufacturer Part Number:

    TLV2760IDBVTG4

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    SOT-23

  • Package Description:

    GREEN, PLASTIC, SOT-23, 6 PIN

  • Pin Count:

    6

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    0

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    0.0002 µA

  • Bias Current-Max (IIB) @25C:

    0.000015 µA

  • Common-mode Reject Ratio-Min:

    55 dB

  • Common-mode Reject Ratio-Nom:

    76 dB

  • Frequency Compensation:

    YES

  • Input Offset Current-Max (IIO):

    0.000015 µA

  • Input Offset Voltage-Max:

    3500 µV

  • JESD-30 Code:

    R-PDSO-G6

  • JESD-609 Code:

    e4

  • Length:

    2.9 mm

  • Low-Bias:

    YES

  • Low-Offset:

    NO

  • Micropower:

    YES

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    6

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LSSOP

  • Package Equivalence Code:

    TSOP6,.11,37

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.45 mm

  • Slew Rate-Min:

    0.07 V/us

  • Slew Rate-Nom:

    0.22 V/us

  • Subcategory:

    Operational Amplifier

  • Supply Current-Max:

    0.028 mA

  • Supply Voltage Limit-Max:

    4 V

  • Supply Voltage-Nom (Vsup):

    2.4 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.95 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

  • Unity Gain BW-Nom:

    500

  • Voltage Gain-Min:

    18000

  • Wideband:

    NO

  • Width:

    1.6 mm

TLV2760IDBVTG4 Frequently Asked Questions (FAQs)

  • Texas Instruments recommends a star-ground connection, with the GND pin connected to a solid ground plane. Keep the input and output traces short and away from noise sources. Place decoupling capacitors close to the VCC and GND pins.
  • The POR and BOR features are enabled by default. To disable them, tie the POR/BOR pin to VCC. For a custom reset threshold, connect a resistor divider from VCC to the POR/BOR pin. Consult the datasheet for specific values.
  • The TLV2760IDBVTG4 can drive up to 1nF of capacitive load. Exceeding this limit may cause oscillations or instability. Use a buffer or add a series resistor to reduce the load capacitance if necessary.
  • The TLV2760IDBVTG4 is rated for operation from -40°C to 125°C. Ensure good thermal design, including heat sinking and airflow, to keep the device within its specified temperature range. Consult the datasheet for thermal resistance values.
  • The recommended input voltage range is 1.7V to 5.5V. Operation outside this range may affect performance or cause damage. Ensure the input voltage is within the specified range for optimal performance.

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TLV2760IDBVTG4 Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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