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TLV3702ID - Texas Instruments

Description: FAMILY OF NANOPOWER PUSH-PULL OUTPUT COMPARATORS

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TLV3702ID - Texas Instruments PCB footprint - Other - Other - SOIC127P600X175-8N
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TLV3702ID - Texas Instruments  - 3D model - Other - SOIC127P600X175-8N
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TLV3702ID Details

  • Manufacturer Part Number:

    TLV3702ID

  • Brand Name:

    Texas Instruments

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    SOIC

  • Pin Count:

    8

  • Country Of Origin:

    Mexico

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    0

  • Amplifier Type:

    COMPARATOR

  • Average Bias Current-Max (IIB):

    0.0015 µA

  • Bias Current-Max (IIB) @25C:

    0.0001 µA

  • Input Offset Voltage-Max:

    5000 µV

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e4

  • Length:

    4.9 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    2

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Type:

    PUSH-PULL

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Packing Method:

    TUBE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Response Time-Nom:

    240000 ns

  • Seated Height-Max:

    1.75 mm

  • Subcategory:

    Comparator

  • Supply Current-Max:

    0.0016 mA

  • Supply Voltage Limit-Max:

    17 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3.9 mm

TLV3702ID Frequently Asked Questions (FAQs)

  • The TLV3702ID is a high-frequency device, so it's essential to follow good PCB layout practices to minimize noise and ensure proper operation. Place the device close to the power supply, use short traces, and avoid routing signals under the device. Also, ensure that the input and output pins are not routed near each other to prevent coupling.
  • The TLV3702ID has a specific power-up sequence requirement. Ensure that the VCC pin is powered up before the VIN pin. Also, the VIN pin should be powered up slowly ( slew rate < 10mV/us) to prevent latch-up. A soft-start circuit can be used to control the power-up sequence.
  • The TLV3702ID can drive capacitive loads up to 100pF. However, it's recommended to limit the capacitive load to 10pF to ensure stable operation. If a larger capacitive load is required, consider adding a series resistor to dampen the output.
  • The TLV3702ID has a high-frequency output, so it's essential to filter out noise and ripple. Use a low-pass filter (e.g., RC filter) with a cut-off frequency below 100kHz to filter out high-frequency noise. Additionally, consider using a ferrite bead or a common-mode choke to filter out high-frequency noise.
  • The TLV3702ID has a thermal derating of 6.4mW/°C above 25°C. Ensure that the device is properly heat-sinked, and the ambient temperature is within the recommended operating range to prevent thermal shutdown.

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TLV3702ID Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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