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TLV5636IDGKR - Texas Instruments

Description: 12-Bit, 1 us DAC Serial Input, Pgrmable Int. Ref., Settling Time

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TLV5636IDGKR - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - DGK
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TLV5636IDGKR Details

  • Manufacturer Part Number:

    TLV5636IDGKR

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    MSOP

  • Pin Count:

    8

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.40

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Analog Output Voltage-Max:

    2.9 V

  • Converter Type:

    D/A CONVERTER

  • Input Bit Code:

    BINARY

  • Input Format:

    SERIAL

  • JESD-30 Code:

    S-PDSO-G8

  • JESD-609 Code:

    e4

  • Length:

    3 mm

  • Linearity Error-Max (EL):

    0.0977%

  • Moisture Sensitivity Level:

    1

  • Number of Bits:

    12

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP8,.19

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Sample Rate:

    0.233 MHz

  • Seated Height-Max:

    1.1 mm

  • Settling Time-Max:

    7 µs

  • Settling Time-Nom (tstl):

    1 µs

  • Supply Current-Max:

    3.3 mA

  • Supply Voltage-Nom:

    3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3 mm

TLV5636IDGKR Frequently Asked Questions (FAQs)

  • The recommended layout and placement for the TLV5636IDGKR involves keeping the analog and digital grounds separate, using a star-ground configuration, and placing the device close to the analog signal sources to minimize noise.
  • The power-up and power-down sequencing for the TLV5636IDGKR involves powering up the analog supply (AVDD) before the digital supply (DVDD), and powering down the digital supply before the analog supply to prevent latch-up.
  • The TLV5636IDGKR can handle clock frequencies up to 20 MHz, but the maximum frequency may vary depending on the specific application and system requirements.
  • To optimize the performance of the TLV5636IDGKR in noisy environments, use a low-pass filter on the analog input, use a shielded cable for the analog signal, and consider using a ferrite bead or common-mode choke to filter out high-frequency noise.
  • The recommended method for calibrating the TLV5636IDGKR involves using an external calibration voltage source, and adjusting the internal offset and gain to achieve the desired accuracy and linearity.

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TLV5636IDGKR Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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