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TLV9352QDGKRQ1 - Texas Instruments

Description: AUTOMOTIVE DUAL-CHANNEL 3.5-MHZ,

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TLV9352QDGKRQ1 - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - DGK  (S-PDSO-G8)
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TLV9352QDGKRQ1 - Texas Instruments  - 3D model - Small Outline Packages - DGK  (S-PDSO-G8)
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TLV9352QDGKRQ1 Details

  • Manufacturer Part Number:

    TLV9352QDGKRQ1

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Common-mode Reject Ratio-Min:

    95 dB

  • Common-mode Reject Ratio-Nom:

    110 dB

  • Frequency Compensation:

    YES

  • Input Offset Voltage-Max:

    1800 µV

  • JESD-30 Code:

    S-PDSO-G8

  • JESD-609 Code:

    e4

  • Length:

    3 mm

  • Low-Bias:

    YES

  • Low-Offset:

    NO

  • Micropower:

    YES

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    2

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP8,.19

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Packing Method:

    TR, 13 INCH

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    1.1 mm

  • Slew Rate-Nom:

    20 V/us

  • Supply Current-Max:

    1.7 mA

  • Supply Voltage Limit-Max:

    42 V

  • Surface Mount:

    YES

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Unity Gain BW-Nom:

    3500

  • Voltage Gain-Min:

    1000000

  • Wideband:

    NO

  • Width:

    3 mm

TLV9352QDGKRQ1 Frequently Asked Questions (FAQs)

  • A good PCB layout for the TLV9352QDGKRQ1 involves keeping the input and output traces separate, using a solid ground plane, and placing decoupling capacitors close to the device. Additionally, it's recommended to use a 4-layer PCB with a dedicated power plane and a dedicated ground plane.
  • The output capacitor for the TLV9352QDGKRQ1 should be chosen based on the desired output voltage ripple, output current, and stability requirements. A general rule of thumb is to use a capacitor with a value between 10uF to 22uF, and a voltage rating of at least 2x the output voltage.
  • The TLV9352QDGKRQ1 can handle input voltages up to 18V, but it's recommended to keep the input voltage below 15V to ensure optimal performance and reliability.
  • To ensure stability, it's recommended to follow the datasheet's guidelines for output capacitor selection, and to add a small ceramic capacitor (e.g. 10nF) between the VIN and GND pins. Additionally, make sure the PCB layout is well-designed and the device is properly decoupled.
  • The TLV9352QDGKRQ1 has a thermal derating of 6.4mW/°C above 25°C, which means the device's power dissipation should be reduced as the ambient temperature increases to prevent overheating.

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TLV9352QDGKRQ1 Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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Part Image TLV9352IDGKR Texas Instruments

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