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TN0110N3-G-P002 - Microchip

Description: MOSFET N-CH 100V 350MA TO92-3

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TN0110N3-G-P002 - Microchip - PCB symbol
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PCB Footprints
TN0110N3-G-P002 - Microchip PCB footprint - Other - Other - 3-Lead TO-92 Package Outline (N3)
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TN0110N3-G-P002 - Microchip - 3D model - Other - 3-Lead TO-92 Package Outline (N3)
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TN0110N3-G-P002 Details

  • Manufacturer Part Number:

    TN0110N3-G-P002

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Pin Count:

    3

  • Manufacturer Package Code:

    TO-92-3

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    Philippines

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.29.00.95

  • Factory Lead Time:

    7 Weeks

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    9

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    100 V

  • Drain Current-Max (ID):

    0.35 A

  • Drain-source On Resistance-Max:

    3 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    8 pF

  • JEDEC-95 Code:

    TO-92

  • JESD-30 Code:

    O-PBCY-T3

  • JESD-609 Code:

    e3

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    ROUND

  • Package Style:

    CYLINDRICAL

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation Ambient-Max:

    1 W

  • Power Dissipation-Max (Abs):

    1 W

  • Surface Mount:

    NO

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Position:

    BOTTOM

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

TN0110N3-G-P002 Frequently Asked Questions (FAQs)

  • Microchip recommends a thermal pad on the bottom of the package, connected to a large copper area on the PCB to dissipate heat. A minimum of 2oz copper thickness is recommended, and the thermal pad should be connected to a ground plane or a dedicated heat sink.
  • To ensure reliable operation in high-vibration environments, Microchip recommends using a robust PCB design, secure component mounting, and conformal coating to prevent moisture ingress. Additionally, consider using a vibration-resistant connector and cable assembly.
  • Microchip recommends soldering the TN0110N3-G-P002 using a reflow soldering process with a peak temperature of 260°C (500°F) for a maximum of 20 seconds. Hand soldering is not recommended due to the device's small size and high pin count.
  • The TN0110N3-G-P002 is rated for operation in a temperature range of -40°C to 125°C (-40°F to 257°F) and humidity up to 60% RH. However, Microchip recommends using a conformal coating and following proper PCB design and assembly practices to ensure reliable operation in harsh environments.
  • Microchip recommends powering up the TN0110N3-G-P002 in the following sequence: VDD, then VCC, and finally the input signals. This sequence helps prevent latch-up and ensures reliable operation.

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TN0110N3-G-P002 Overview

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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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