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TN2124K1-G - Microchip

Description: MICROCHIP - TN2124K1-G - MOSFET, 240V, 0.134A, 150DEG C, 0.36W

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PCB Footprints
TN2124K1-G - Microchip PCB footprint - SOT23 (3-Pin) - SOT23 (3-Pin) - 3-Lead TO-236AB (SOT-23) Package Outline (K1) 2.90x1.30mm body, 1.12mm height (max), 1.90mm pitch
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3D Models
TN2124K1-G - Microchip  - 3D model - SOT23 (3-Pin) - 3-Lead TO-236AB (SOT-23) Package Outline (K1) 2.90x1.30mm body, 1.12mm height (max), 1.90mm pitch
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  • Datasheet Download Datasheet
  • Stock & Prices $ Price & Stock for TN2124K1-G
  • Part Number TN2124K1-G
  • Manufacturer Microchip
  • Pin Count 3
  • Part Category MOSFET (N-Channel)
  • Package Category SOT23 (3-Pin)
  • Footprint Name SOT23 (3-Pin) - 3-Lead TO-236AB (SOT-23) Package Outline (K1) 2.90x1.30mm body, 1.12mm height (max), 1.90mm pitch
  • Released Date Sep 4, 2019
  • Last Modified Date Mar 7, 2023 4:10 PM UTC
  • Pinout / Pin List Click Here (Member Only)

TN2124K1-G Details

  • Manufacturer Part Number:

    TN2124K1-G

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    2.90 X 1.30 MM, 1.12 MM HEIGHT, GREEN PACKAGE-3

  • Pin Count:

    3

  • Manufacturer Package Code:

    SOT-23-3

  • Country Of Origin:

    Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.29.00.95

  • Factory Lead Time:

    5 Weeks

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    9

  • Additional Feature:

    LOW THRESHOLD

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    240 V

  • Drain Current-Max (ID):

    0.134 A

  • Drain-source On Resistance-Max:

    15 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    5 pF

  • JEDEC-95 Code:

    TO-236AB

  • JESD-30 Code:

    R-PDSO-G3

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation Ambient-Max:

    0.36 W

  • Power Dissipation-Max (Abs):

    0.36 W

  • Qualification Status:

    Not Qualified

  • Reference Standard:

    TS 16949

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

TN2124K1-G Frequently Asked Questions (FAQs)

  • Microchip recommends a 2-layer or 4-layer PCB with a solid ground plane and thermal vias to dissipate heat efficiently. A minimum of 1 oz copper thickness is recommended.
  • Ensure proper thermal management, use a stable power supply, and follow the recommended operating conditions. Also, consider using a thermistor or thermocouple to monitor temperature and adjust the system accordingly.
  • The TN2124K1-G has built-in ESD protection diodes on all pins. However, it's still recommended to follow proper ESD handling procedures during assembly and testing. For latch-up prevention, ensure that the device is powered up and down slowly, and avoid voltage spikes or transients.
  • Yes, the TN2124K1-G is suitable for high-reliability and safety-critical applications. However, it's essential to follow Microchip's guidelines for reliability and fault tolerance, and to perform thorough testing and validation for your specific use case.
  • Follow the IPC-J-STD-020D standard for soldering and rework. The recommended soldering temperature is 260°C (500°F) for a maximum of 10 seconds. For rework, use a low-temperature soldering iron and avoid applying excessive heat or force.

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TN2124K1-G Overview

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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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Small Signal Field-Effect Transistor, 0.134A I(D), 240V, 1-Element, N-Channel, Silicon, Metal-oxide Semiconductor FET, TO-236AB