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TPA0211DGN - Texas Instruments

Description: 2-W, mono, analog input Class-AB audio amplifier

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PCB Footprints
TPA0211DGN - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - DGN0008D -2021
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3D Models
TPA0211DGN - Texas Instruments  - 3D model - Small Outline Packages - DGN0008D -2021
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TPA0211DGN Details

  • Manufacturer Part Number:

    TPA0211DGN

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    MSOP

  • Pin Count:

    8

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Bandwidth-Nom:

    20 kHz

  • Consumer IC Type:

    AUDIO AMPLIFIER

  • Gain:

    2.5 dB

  • Harmonic Distortion:

    1%

  • JESD-30 Code:

    S-PDSO-G8

  • JESD-609 Code:

    e4

  • Length:

    3 mm

  • Moisture Sensitivity Level:

    1

  • Noise Figure-Nom:

    93 dB

  • Number of Channels:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Power-Nom:

    2 W

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HTSSOP

  • Package Equivalence Code:

    TSSOP8,.19

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.1 mm

  • Supply Current-Max:

    6 mA

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    2.5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3 mm

TPA0211DGN Frequently Asked Questions (FAQs)

  • According to TI's application notes, a 10uF capacitor in parallel with a 100nF capacitor is recommended for power supply decoupling to ensure stability and noise reduction.
  • The gain setting depends on the specific application requirements. TI recommends using the gain calculation formula provided in the datasheet and adjusting the gain resistors accordingly. Additionally, consider the input impedance, output impedance, and desired signal-to-noise ratio when optimizing the gain setting.
  • The TPA0211DGN can handle up to 2.5W of continuous average power and up to 5W of peak power. However, the actual power handling capability depends on the specific application, PCB layout, and thermal management.
  • To ensure EMC, follow proper PCB layout guidelines, use a shielded enclosure, and consider adding EMI filters or ferrite beads to the input and output lines. Additionally, ensure that the amplifier is properly grounded and that the power supply is well-regulated.
  • TI recommends using a heat sink with a thermal resistance of less than 10°C/W to maintain a junction temperature below 150°C. Additionally, ensure good airflow around the amplifier and consider using thermal interface materials to improve heat transfer.

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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