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TPA0211DGNR - Texas Instruments

Description: Mono Class-AB Audio Amplifier with Mono Headphone Drive

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TPA0211DGNR - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - DGN-8
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TPA0211DGNR - Texas Instruments  - 3D model - Small Outline Packages - DGN-8
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TPA0211DGNR Details

  • Manufacturer Part Number:

    TPA0211DGNR

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    MSOP

  • Pin Count:

    8

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Bandwidth-Nom:

    20 kHz

  • Consumer IC Type:

    AUDIO AMPLIFIER

  • Gain:

    2.5 dB

  • Harmonic Distortion:

    1%

  • JESD-30 Code:

    S-PDSO-G8

  • JESD-609 Code:

    e4

  • Length:

    3 mm

  • Moisture Sensitivity Level:

    1

  • Noise Figure-Nom:

    93 dB

  • Number of Channels:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Power-Nom:

    2 W

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HTSSOP

  • Package Equivalence Code:

    TSSOP8,.19

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.1 mm

  • Supply Current-Max:

    6 mA

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    2.5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3 mm

TPA0211DGNR Frequently Asked Questions (FAQs)

  • TI recommends using a 10uF capacitor in parallel with a 0.1uF capacitor, placed as close as possible to the power pins, to ensure stable operation.
  • The gain setting depends on the specific application requirements. TI provides a gain calculation formula in the datasheet. For a more detailed analysis, use TI's online gain calculator tool or consult with a TI engineer.
  • The TPA0211DGNR can handle up to 10W of continuous average power, but this may vary depending on the specific application, PCB design, and thermal management. Consult the datasheet and thermal design guidelines for more information.
  • Follow proper PCB design and layout guidelines, use shielding and filtering as needed, and ensure that the amplifier is properly grounded. Consult the datasheet and TI's EMC application notes for more information.
  • Use a heat sink with a thermal resistance of 10°C/W or lower, and ensure good airflow around the device. Consult the datasheet and TI's thermal design guidelines for more information.

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TPA0211DGNR Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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