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TPA2005D1DGN - Texas Instruments

Description: Audio Amplifiers Mono Fully Diff Filter-Free Class-D

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TPA2005D1DGN - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - DGN (S-PDSO-G8)-8
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TPA2005D1DGN - Texas Instruments  - 3D model - Small Outline Packages - DGN (S-PDSO-G8)-8
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TPA2005D1DGN Details

  • Manufacturer Part Number:

    TPA2005D1DGN

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    MSOP

  • Pin Count:

    8

  • Country Of Origin:

    Mainland China, Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Bandwidth-Nom:

    20 kHz

  • Consumer IC Type:

    CLASS D AUDIO AMPLIFIER

  • Harmonic Distortion:

    10%

  • JESD-30 Code:

    S-PDSO-G8

  • JESD-609 Code:

    e4

  • Length:

    3 mm

  • Moisture Sensitivity Level:

    1

  • Noise Figure-Nom:

    97 dB

  • Number of Channels:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Power-Nom:

    1.4 W

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HTSSOP

  • Package Equivalence Code:

    TSSOP8,.19

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.1 mm

  • Supply Current-Max:

    4.5 mA

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    2.5 V

  • Surface Mount:

    YES

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3 mm

TPA2005D1DGN Frequently Asked Questions (FAQs)

  • TI recommends using a 10uF capacitor in parallel with a 100nF capacitor, both connected between the power supply pins (VCC and GND) to ensure stable operation.
  • The gain setting depends on the input signal level and the desired output power. TI provides a gain calculation formula in the datasheet. For a more detailed analysis, use TI's online gain calculator tool or consult with a TI engineer.
  • The maximum power dissipation is dependent on the ambient temperature and the thermal resistance of the package. For the TPA2005D1DGN, the maximum power dissipation is approximately 2.5W at 25°C ambient temperature.
  • Implement thermal protection by monitoring the die temperature and shutting down the device if it exceeds 150°C. You can also use thermal pads or heat sinks to improve heat dissipation.
  • Follow TI's recommended PCB layout guidelines, which include using a solid ground plane, placing decoupling capacitors close to the device, and minimizing trace lengths and widths to reduce electromagnetic interference (EMI).

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TPA2005D1DGN Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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Part Image TPA2005D1DGNR Texas Instruments

1.4W, 1 Channel(s), 1 Func, PDSO8